A cooling plate interface is a structural component that connects cooling plates to machine enclosures for efficient heat dissipation in industrial equipment.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Pressure Rating | 0.5-2.0 MPa | |
| Surface Flatness | ≤0.05 mm/m | |
| Surface Roughness | Ra 0.8-3.2 μm | |
| Interface Thickness | 3-12 mm | |
| Thermal Conductivity | 150-400 W/m·K | |
| Mounting Hole Pattern | Standardized grid (e.g., 25mm, 50mm spacing) | |
| Operating Temperature Range | -40°C to 150°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Cooling Plate Interface.
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The primary function is to create an efficient thermal connection between cooling plates and machine structures, ensuring optimal heat transfer while maintaining mechanical stability and accommodating thermal expansion differences.
Material selection depends on thermal conductivity requirements, environmental conditions (corrosion resistance), weight constraints, and cost. Aluminum alloys offer good balance of conductivity and weight, copper provides maximum conductivity, and stainless steel offers corrosion resistance in harsh environments.
Regular inspection for surface degradation, cleaning of thermal interface materials, checking mounting torque, and monitoring for thermal performance degradation. Thermal interface materials may need periodic replacement depending on operating conditions.
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