Thin copper layers in HDI PCBs that provide electrical connectivity between circuit elements.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Purity | ≥99.9% Cu | |
| Thickness | 12μm to 35μm (standard) | |
| Elongation | ≥10% | |
| Peel Strength | ≥0.8 N/mm | |
| Sheet Resistance | ≤0.5 mΩ/sq | |
| Tensile Strength | ≥200 MPa | |
| Surface Roughness | Rz < 3μm |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Copper Conductive Layers.
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Copper conductive layers serve as the primary electrical pathways in HDI PCBs, enabling signal transmission, power distribution, and ground connections between electronic components while maintaining signal integrity in high-density designs.
Copper layers are typically applied through electroplating, sputtering, or lamination processes, followed by photolithographic patterning to create specific circuit traces, with additional surface treatments applied for solderability and corrosion resistance.
Key performance factors include copper purity, layer thickness, surface roughness, adhesion strength, thermal conductivity, and resistance to electromigration and thermal stress during operation.
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