A die attach pad is a metalized area on a substrate or leadframe that provides mechanical support, electrical connection, and thermal dissipation for semiconductor die attachment in electronic packaging.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Size | Varies by die dimensions (e.g., 2mm x 2mm to 10mm x 10mm) | |
| Flatness | < 0.05mm tolerance | |
| Thickness | Typically 0.1mm to 0.5mm | |
| Surface Finish | Electroplated nickel/gold, OSP, or bare copper | |
| Thermal Conductivity | 200-400 W/mK for copper-based pads | |
| Electrical Resistivity | < 0.1 ohm for conductive pads |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
Compare the published product scope and source details, then include your specifications and quantity in an enquiry.
Manufacturer profiles associated with Die Attach Pad.
Explore company information and manufacturing capabilities, then discuss the scope of your project with a relevant supplier.
The primary function is to provide mechanical support, electrical connectivity (often grounding), and thermal dissipation for the semiconductor die, ensuring device reliability and performance.
Common materials include copper alloys for leadframes, and metallized surfaces like copper or silver on substrates, often paired with adhesives such as epoxy or solder for bonding.
It conducts heat away from the die to the package or heat sink, preventing overheating and maintaining optimal operating temperatures, which is critical for high-power devices.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.