Editorial Technical Reference

Package

This page explains how Package is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

In a 3-axis gyroscope, the package is the physical enclosure that protects the delicate MEMS (Micro-Electro-Mechanical Systems) sensor die from environmental factors such as moisture, dust, and mechanical stress.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Package

Definition
In a 3-axis gyroscope, the package is the physical enclosure that protects the delicate MEMS (Micro-Electro-Mechanical Systems) sensor die from environmental factors such as moisture, dust, and mechanical stress. It provides the structural framework, electrical connections (typically via leads, pads, or a ball grid array), and often includes a hermetic seal to ensure long-term reliability and performance stability of the inertial measurement unit. The package is a passive component; it does not perform sensing but enables the gyroscope to function by providing a stable mechanical platform and electrical interconnection to the external circuit board. It also shields the internal components from external environmental and electromagnetic interference. Materials commonly used include plastic (e.g., epoxy molding compound), ceramic (e.g., alumina), and metal (e.g., Kovar alloy for lids). The overall package dimensions (length x width x height) are critical for PCB footprint and assembly, and must be verified for the specific model. No specific standards are listed for this product. Always confirm model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The package does not have an active working principle like a sensor element. Its function is passive: to physically contain the gyroscope die, provide a stable mechanical platform, facilitate electrical interconnection to the external circuit board, and shield the internal components from external environmental and electromagnetic interference.
Common Materials
Plastic (e.g., Epoxy Molding Compound), Ceramic (e.g., Alumina), Metal (e.g., Kovar alloy for lids)
Technical Parameters

What to specify in your RFQ

  • Overall package dimensions (length x width x height), critical for PCB (Printed Circuit Board) footprint and assembly. in mm

These are the quantities to specify to the manufacturer when sizing or requesting a quote. The manufacturer's own documentation governs the exact figures and applicable standard.

Components / BOM
  • Leadframe / Substrate Part
    Provides the structural base and electrical interconnect traces between the die and the external pins/pads.
    Material: Copper alloy
  • Die Attach Pad Part
    The area on the leadframe/substrate where the gyroscope sensor die is mounted and bonded.
    Material: Metal (often plated)
  • Wire Bonds / Solder Bumps Part
    Create electrical connections between the die's bond pads and the leadframe/substrate terminals.
    Material: Gold wire or Solder alloy
  • Molding Compound / Lid Part
    Forms the main protective body (plastic molding) or seals the cavity (ceramic/metal lid).
    Material: Epoxy resin or Ceramic/Metal

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 atm (non-pressurized)
other spec: Humidity: 0-95% RH non-condensing, Vibration: 20g max, Shock: 2000g max
temperature: -40°C to +85°C
Media Compatibility
✓ Clean dry air ✓ Inert gas environments ✓ Non-corrosive industrial atmospheres
Unsuitable: Direct liquid immersion or high-pressure washdown
Sizing Data Required
  • PCB footprint dimensions (mm)
  • Required connector type and pin count
  • Mounting method and clearance requirements

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Seal degradation
Cause: Chemical incompatibility between package seal materials and stored contents, leading to swelling, hardening, or cracking over time
Structural fatigue
Cause: Repeated mechanical stress from handling, stacking, or transportation causing material fatigue at stress concentration points like corners or seams
Maintenance Indicators
  • Visible bulging or deformation of package walls indicating pressure buildup or structural compromise
  • Audible hissing or whistling sounds suggesting seal failure and gas/fluid leakage
Engineering Tips
  • Implement material compatibility testing before selecting packaging for specific contents, considering chemical resistance, temperature tolerance, and mechanical properties
  • Use strain gauges or pressure sensors during transport simulations to identify and reinforce high-stress areas in package design

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI/ASQ Z1.4-2008 - Sampling Procedures and Tables for Inspection by Attributes DIN 55350-12:1989 - Concepts of Quality Management and Statistics

Quoted from the published standard.

Manufacturing Precision
  • Dimensional Stability: +/-0.5mm
  • Seal Integrity: Leak Rate < 0.01 cc/min
Quality Inspection
  • Visual Inspection for Surface Defects
  • Compression Test for Structural Integrity

Manufacturers of Package

Manufacturer profiles associated with Package.

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Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
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Frequently Asked Questions

What is the primary function of the package in a 3-axis gyroscope?

The package protects the MEMS sensor die from environmental factors like moisture, dust, and mechanical stress, and provides electrical connections to the external circuit board.

What materials are commonly used for the package?

Common materials include plastic (e.g., epoxy molding compound), ceramic (e.g., alumina), and metal (e.g., Kovar alloy for lids).

What is the key parameter to consider for PCB assembly?

The overall package dimensions (length x width x height) are critical for PCB footprint and assembly. Verify these dimensions for the specific model.

Does the package have an active working principle?

No, the package is passive. It does not sense but provides mechanical support, electrical interconnection, and environmental shielding.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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