Dielectric substrate is a specialized insulating material used in directional couplers to support and separate conductive elements while controlling electromagnetic wave propagation.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Surface Roughness | 0.1-3.0 μm | |
| Moisture Absorption | 0.01-0.5% | |
| Thickness Tolerance | ±5-10% | |
| Thermal Conductivity | 0.2-2.0 W/m·K | |
| Loss Tangent (tan δ) | 0.0009-0.02 | |
| Operating Temperature | -55°C to +150°C | |
| Dielectric Constant (εr) | 2.1-10.5 | |
| Thermal Coefficient Of εr | -50 to +200 ppm/°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
Passive microwave/RF components that sample a portion of signal power from a transmission line in a specific direction while maintaining isolation from signals traveling in the opposite direction.
A printed circuit board with copper thickness significantly greater than standard PCBs, designed for high-current applications and enhanced thermal management.
A printed circuit board consisting of multiple conductive copper layers separated by insulating dielectric materials, laminated together to form a single integrated board.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Dielectric Substrate.
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The dielectric constant (εr) is most critical as it determines the phase velocity and physical dimensions of the coupler. Consistency of εr across the substrate and with temperature is essential for predictable performance.
Substrate thickness directly affects impedance matching and coupling coefficient. Thicker substrates typically provide better power handling but may reduce coupling tightness. Optimal thickness balances mechanical stability with electrical performance requirements.
Not without redesign. Different substrates have varying dielectric constants, requiring adjustment of conductor dimensions to maintain impedance matching and coupling characteristics. Substitution typically requires recalculation of all geometric parameters.
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