This page explains how Multilayer PCB is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board consisting of multiple conductive copper layers separated by insulating dielectric materials, laminated together to form a single integrated board.
Technical details and manufacturing context for Multilayer PCB
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Layer CountRequired | 4–12 layers | Total number of conductive copper layers in the PCBIEC 62326-4 |
| Board ThicknessRequired | 0.8–2.4 mm | Overall thickness of the finished multilayer PCBIPC-6012 |
| Copper WeightRequired | 0.5–2 oz/ft² | Thickness of copper on each layer, typically 0.5oz to 2ozIPC-6012 |
| Minimum Trace WidthRequired | 0.075–0.15 mil | Smallest width of copper traces that can be manufacturedIPC-2221 |
| Minimum Via DiameterRequired | 0.15–0.3 mil | Smallest diameter of plated through-holesIPC-2221 |
| Dielectric Constant | 3.5–4.5 dimensionless | Relative permittivity of the insulating material at 1MHzIPC-4101 |
| Glass Transition Temperature | 130–180 °C | Temperature at which the dielectric material transitions from rigid to softIPC-4101 |
| Maximum Operating Temperature | 85–150 °C | Exceeding may cause delamination.IPC-6012 |
| Surface Finish | HASL, ENIG, OSP | Affects solderability and shelf life.IPC-4552 |
| Impedance Tolerance | ±10 % | Critical for high-speed signal integrity.IPC-2141 |
| Peel Strength | 0.7–1.4 N/mm | Ensures copper adhesion to substrate.IPC-TM-650 |
| Flammability Rating | 94V-0 | Required for safety in consumer electronics.UL 94 |
| Operating Humidity | 5–95 % RH | Non-condensing; high humidity may cause corrosion.IEC 60068-2-78 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Multilayer PCB.
| pressure: | Atmospheric to 1 atm (standard), vacuum compatible for assembly processes |
| other spec: | Layer count: 2-50+ layers, dielectric constant: 3.0-4.5, copper thickness: 0.5-6 oz/ft² |
| temperature: | -40°C to +130°C (operating), up to +260°C (soldering peak) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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According to the directory reference, the layer count ranges from 4 to 12 layers. However, the exact number depends on the circuit complexity and application requirements. Always verify the specific layer count with the manufacturer or supplier for your intended use.
Relevant standards include IEC 62326-4 for layer count, IPC-6012 for board thickness and copper weight, IPC-2221 for trace width and via diameter, IPC-4101 for dielectric constant and glass transition temperature, IPC-4552 for surface finish, IPC-2141 for impedance tolerance, IPC-TM-650 for peel strength, UL 94 for flammability, and IEC 60068-2-78 for humidity. These are procurement references; compliance must be confirmed with the manufacturer.
Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservative). The choice affects solderability and shelf life. Verify the finish suitable for your application with the supplier.
The reference range is 85 to 150 °C. Exceeding this may cause delamination. However, the actual maximum depends on the materials and design. Always check the manufacturer's datasheet for the specific product.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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