Infrared LED Die: Wavelength 850-950 nm

Component Specifications

Definition

An infrared LED die is a miniature semiconductor device fabricated from gallium arsenide (GaAs) or aluminum gallium arsenide (AlGaAs) materials, designed to emit electromagnetic radiation in the infrared spectrum (typically 850-950 nm wavelength) when forward-biased. As the core light source in photocoupler assemblies, it converts electrical signals into optical signals that traverse an isolation barrier to activate a photodetector, enabling galvanic isolation between circuits.

Working Principle

Operates on electroluminescence principle: when forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy as photons in the infrared spectrum. The emitted IR light intensity is directly proportional to the forward current.

Materials

Gallium Arsenide (GaAs) or Aluminum Gallium Arsenide (AlGaAs) epitaxial layers on substrate, with gold or aluminum bonding wires, encapsulated in transparent silicone or epoxy for optical transmission.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Wavelength	850-950 nm
Viewing Angle	15-30 degrees
Rise/Fall Time	10-100 ns
Forward Current	20-100 mA
Forward Voltage	1.2-1.6V
Radiant Intensity	10-100 mW/sr

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IEC 60747-5-2, JEDEC JESD22

Parent Products

This component is used in the following industrial products

Photocoupler Assembly

A complete assembly containing the core photocoupler device and its supporting electrical/mechanical elements, designed for integration into an isolation barrier system.

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Engineering Analysis

Risks & Mitigation

Electrostatic discharge damage during handling
Thermal degradation from excessive current
Delamination of encapsulation materials
Wavelength drift over temperature cycles

FMEA Triads

Trigger: Excessive forward current beyond specifications
Failure: Thermal runaway leading to catastrophic failure
Mitigation: Implement current-limiting circuits and thermal management in driver design

Trigger: Electrostatic discharge during assembly
Failure: Latent or immediate junction damage reducing output
Mitigation: ESD-protected workstations and proper handling procedures

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±5% wavelength variation, ±10% radiant intensity

Test Method

IEC 60747-5-2 for optoelectronic devices, including spectral distribution, forward voltage, and radiant intensity measurements under controlled conditions

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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Manufacturers of Infrared LED Die

Manufacturer profiles associated with Infrared LED Die.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the primary function of an infrared LED die in photocouplers?

The infrared LED die serves as the light source that converts electrical input signals into infrared optical signals, which then cross an isolation gap to activate a photodetector, providing electrical isolation between circuits while transmitting signals.

Why are infrared wavelengths preferred over visible light in photocouplers?

Infrared wavelengths (850-950 nm) are used because silicon photodetectors have peak sensitivity in this range, resulting in higher efficiency. Additionally, IR light is invisible, reduces interference from ambient light, and allows for better material compatibility with encapsulation compounds.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Infrared LED Die