Metallization / Bonding Pads: Pad Size 50-150 μm diameter

Component Specifications

Definition

Metallization refers to the deposition of thin metal layers (typically aluminum, gold, or copper) on semiconductor surfaces to create conductive pathways. Bonding pads are specific metallized areas designed for wire bonding or flip-chip connections, enabling electrical interfacing between the photodiode array and external circuitry. These components ensure reliable signal extraction, power distribution, and mechanical stability in optoelectronic devices.

Working Principle

Metallization forms conductive traces through physical vapor deposition (PVD) or chemical vapor deposition (CVD), while bonding pads serve as contact points for wire bonding (using thermosonic, ultrasonic, or thermocompression techniques) or solder bumps. They facilitate electron flow from the photodiode's active region to external leads, maintaining low resistance and minimal signal loss.

Materials

Aluminum (Al), Gold (Au), Copper (Cu), or alloys; often with adhesion layers (e.g., titanium, chromium) and barrier layers (e.g., nickel, palladium) to prevent diffusion and oxidation. Dielectric underlayers like silicon dioxide (SiO2) or silicon nitride (Si3N4) provide insulation.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Pad Size	50-150 μm diameter
Metal Thickness	0.5-2 μm
Sheet Resistance	<0.1 Ω/sq
Adhesion Strength	>50 MPa
Wire Bond Pull Strength	>5 gf

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 14644-1, DIN EN 60749-25, JEDEC JESD22-B116

Parent Products

This component is used in the following industrial products

Photodiode Array

A linear or two-dimensional arrangement of multiple photodiodes integrated on a single semiconductor substrate for simultaneous detection of light intensity across multiple points.

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Engineering Analysis

Risks & Mitigation

Delamination due to poor adhesion
Corrosion from environmental exposure
Electromigration causing open circuits
Wire bond fatigue failure

FMEA Triads

Trigger: Inadequate adhesion layer deposition
Failure: Metal layer delamination
Mitigation: Implement strict process controls for PVD/CVD, use adhesion promoters, and perform regular peel tests per DIN EN 60749-25.

Trigger: Contamination during bonding
Failure: High contact resistance or open circuit
Mitigation: Enforce cleanroom protocols (ISO 14644-1), use automated bonding equipment with real-time monitoring, and apply plasma cleaning pre-treatment.

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±5% on pad dimensions, ±10% on metal thickness

Test Method

Electrical testing (four-point probe for resistivity), shear/pull tests for bond strength, SEM/EDS for material analysis

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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Manufacturers of Metallization / Bonding Pads

Manufacturer profiles associated with Metallization / Bonding Pads.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the primary function of bonding pads in a photodiode array?

Bonding pads provide reliable electrical connection points for wire bonding or flip-chip attachments, enabling signal transmission from the photodiode to external circuits with minimal resistance and signal degradation.

Why is gold commonly used for bonding pads?

Gold offers excellent conductivity, corrosion resistance, and ductility, making it ideal for wire bonding processes. It also forms reliable intermetallic bonds with aluminum wires, ensuring long-term stability in harsh environments.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Metallization / Bonding Pads