Mounting Plate/Guide Plate: Thickness 6-25 mm

Component Specifications

Definition

A mounting plate/guide plate is a critical structural component in electrical test probe arrays, designed to precisely position and secure test probes for accurate electrical contact with electronic devices under test (DUTs). It ensures consistent probe alignment, minimizes deflection, and maintains proper electrical isolation between probes during high-frequency or high-current testing applications.

Working Principle

The plate provides a rigid, flat reference surface with precisely machined holes or slots that guide and secure test probes. It maintains geometric stability under mechanical loads and thermal variations, ensuring repeatable probe positioning for reliable electrical measurements. Alignment features (e.g., dowel pins, edge guides) interface with the test fixture to achieve micron-level accuracy.

Materials

Aluminum 6061-T6 (anodized) for lightweight rigidity; Stainless Steel 304/316 for high-wear or corrosive environments; Glass-filled PEEK or Vespel for electrical insulation and thermal stability; Ceramic (Al2O3) for ultra-high frequency applications requiring low dielectric loss.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Flatness	≤0.05 mm/m
Thickness	6-25 mm
Parallelism	≤0.02 mm
Surface Roughness	Ra 0.8 μm
Dielectric Strength	≥15 kV/mm (for insulating variants)
Operating Temperature	-40°C to +150°C
Hole Position Tolerance	±0.01 mm

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 1101, DIN 876, IPC-9261

Parent Products

This component is used in the following industrial products

Electrical Test Probe Array

A precisely arranged collection of electrical contact probes used for automated testing of electronic circuits and components.

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Engineering Analysis

Risks & Mitigation

Probe misalignment causing false opens/shorts
Material thermal expansion altering probe positions
Wear at guide holes leading to positional drift
Electrostatic discharge (ESD) damage in ungrounded plates

FMEA Triads

Trigger: Inadequate flatness or thermal stability
Failure: Probe tips misalign, causing inconsistent contact resistance
Mitigation: Use materials with low CTE (e.g., Invar, ceramic); implement thermal compensation in fixture design

Trigger: Wear at guide holes from repeated probe insertion
Failure: Increased hole clearance leads to probe wobble and positional errors
Mitigation: Apply hardened bushings (e.g., tungsten carbide) or use self-lubricating materials like PEEK

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Geometric tolerances per ISO 1101; positional tolerances within ±0.01 mm for probe holes

Test Method

CMM (Coordinate Measuring Machine) verification of flatness and hole positions; dielectric withstand testing per IEC 60112 for insulating variants

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

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Manufacturers of Mounting Plate/Guide Plate

Manufacturer profiles associated with Mounting Plate/Guide Plate.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the difference between a mounting plate and a guide plate in probe arrays?

A mounting plate primarily secures probes in fixed positions, while a guide plate includes alignment features (e.g., tapered entries, bushings) to actively guide probes during engagement with the device under test, reducing bending and wear.

How does material choice affect performance in high-frequency testing?

Materials like ceramic or low-loss plastics minimize signal attenuation and crosstalk at high frequencies by providing stable dielectric properties, whereas metals may require insulation coatings to prevent short circuits.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Mounting Plate/Guide Plate