INDUSTRY COMPONENT

Mounting Plate/Guide Plate

Precision mounting and alignment component for electrical test probe arrays in electronic testing systems.

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Component Specifications

Definition
A mounting plate/guide plate is a critical structural component in electrical test probe arrays, designed to precisely position and secure test probes for accurate electrical contact with electronic devices under test (DUTs). It ensures consistent probe alignment, minimizes deflection, and maintains proper electrical isolation between probes during high-frequency or high-current testing applications.
Working Principle
The plate provides a rigid, flat reference surface with precisely machined holes or slots that guide and secure test probes. It maintains geometric stability under mechanical loads and thermal variations, ensuring repeatable probe positioning for reliable electrical measurements. Alignment features (e.g., dowel pins, edge guides) interface with the test fixture to achieve micron-level accuracy.
Materials
Aluminum 6061-T6 (anodized) for lightweight rigidity; Stainless Steel 304/316 for high-wear or corrosive environments; Glass-filled PEEK or Vespel for electrical insulation and thermal stability; Ceramic (Al2O3) for ultra-high frequency applications requiring low dielectric loss.
Technical Parameters
  • Flatness ≤0.05 mm/m
  • Thickness 6-25 mm
  • Parallelism ≤0.02 mm
  • Surface Roughness Ra 0.8 μm
  • Dielectric Strength ≥15 kV/mm (for insulating variants)
  • Operating Temperature -40°C to +150°C
  • Hole Position Tolerance ±0.01 mm
Standards
ISO 1101, DIN 876, IPC-9261

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Mounting Plate/Guide Plate.

test probe mounting plate guide plate probe alignment fixture electrical test fixture component PCB test fixture semiconductor probe card plate Mounting Plate/Guide Plate Mounting Plate/Guide Plate in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Electrical Test Probe Array

A precisely arranged collection of electrical contact probes used for automated testing of electronic circuits and components.

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Engineering Analysis

Risks & Mitigation
  • Probe misalignment causing false opens/shorts
  • Material thermal expansion altering probe positions
  • Wear at guide holes leading to positional drift
  • Electrostatic discharge (ESD) damage in ungrounded plates
FMEA Triads
Trigger: Inadequate flatness or thermal stability
Failure: Probe tips misalign, causing inconsistent contact resistance
Mitigation: Use materials with low CTE (e.g., Invar, ceramic); implement thermal compensation in fixture design
Trigger: Wear at guide holes from repeated probe insertion
Failure: Increased hole clearance leads to probe wobble and positional errors
Mitigation: Apply hardened bushings (e.g., tungsten carbide) or use self-lubricating materials like PEEK

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Geometric tolerances per ISO 1101; positional tolerances within ±0.01 mm for probe holes
Test Method
CMM (Coordinate Measuring Machine) verification of flatness and hole positions; dielectric withstand testing per IEC 60112 for insulating variants

Buyer Feedback

★★★★☆ 4.5 / 5.0 (12 reviews)

"Great transparency on the Mounting Plate/Guide Plate components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."

"The Mounting Plate/Guide Plate we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."

"Found 30+ suppliers for Mounting Plate/Guide Plate on CNFX, but this spec remains the most cost-effective."

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Frequently Asked Questions

What is the difference between a mounting plate and a guide plate in probe arrays?

A mounting plate primarily secures probes in fixed positions, while a guide plate includes alignment features (e.g., tapered entries, bushings) to actively guide probes during engagement with the device under test, reducing bending and wear.

How does material choice affect performance in high-frequency testing?

Materials like ceramic or low-loss plastics minimize signal attenuation and crosstalk at high frequencies by providing stable dielectric properties, whereas metals may require insulation coatings to prevent short circuits.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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