INDUSTRY COMPONENT

Package/Casing

Protective housing for laser diodes ensuring thermal management, hermetic sealing, and optical alignment in industrial applications.

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Component Specifications

Definition
A precision-engineered enclosure designed to house laser diode chips, providing mechanical protection, thermal dissipation through integrated heat sinks, hermetic sealing to prevent contamination, and precise optical alignment for beam emission. It incorporates electrical contacts, optical windows/lenses, and mounting interfaces compatible with industrial laser systems.
Working Principle
The casing dissipates heat generated by the laser diode via conductive materials (e.g., copper, aluminum) to maintain optimal operating temperatures, while hermetically sealing the interior with glass or ceramic windows to protect the semiconductor from environmental factors. It aligns the diode's emission axis with external optics through precision machining.
Materials
Copper-tungsten (CuW) or aluminum nitride (AlN) for baseplates; Kovar or stainless steel for sidewalls; borosilicate glass or sapphire for optical windows; gold-plated contacts.
Technical Parameters
  • Dimensions TO-3, TO-9, or custom footprints
  • Hermeticity < 5×10⁻⁸ atm·cc/s He
  • Optical Aperture 3-10 mm diameter
  • Thermal Resistance < 10 K/W
  • Operating Temperature -40°C to +85°C
Standards
ISO 10110, IEC 60825, MIL-PRF-38534

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package/Casing.

laser diode package diode casing TO-can hermetic packaging optoelectronic enclosure thermal management industrial laser components Package/Casing Package/Casing in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Laser Diode

A semiconductor device that emits coherent light through stimulated emission, used as the light source in particulate matter sensors.

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Power Semiconductor Switch(es)

Electronic switching device that controls high-power electrical circuits using semiconductor technology

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Switching Element

A component within a power control output system that enables or interrupts electrical current flow.

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Engineering Analysis

Risks & Mitigation
  • Thermal runaway due to inadequate heat dissipation
  • Hermeticity failure leading to diode degradation
  • Misalignment causing beam divergence or power loss
FMEA Triads
Trigger: Poor solder joint between diode and baseplate
Failure: Increased thermal resistance and overheating
Mitigation: Use automated soldering with X-ray inspection and thermal cycling tests.
Trigger: Seal glass cracking under thermal stress
Failure: Loss of hermeticity and contamination ingress
Mitigation: Implement stress-relief designs and CTE-matched materials.

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.05 mm for optical axis alignment, ±1° for window parallelism
Test Method
Helium leak testing per MIL-STD-883, thermal imaging for hotspot detection, spectroradiometry for optical output verification

Buyer Feedback

★★★★☆ 4.9 / 5.0 (39 reviews)

"Reliable performance in harsh Computer, Electronic and Optical Product Manufacturing environments. No issues with the Package/Casing so far."

"Testing the Package/Casing now; the technical reliability results are within 1% of the laboratory datasheet."

"Impressive build quality. Especially the technical reliability is very stable during long-term operation."

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Frequently Asked Questions

What is the primary function of a laser diode package?

To protect the diode chip from environmental damage, dissipate heat, and provide electrical/optical interfaces for integration into laser systems.

Why is hermetic sealing critical in industrial laser diode casings?

It prevents moisture, dust, and gases from degrading the semiconductor, ensuring long-term reliability and stable optical performance.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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