Rugged enclosure for modular industrial edge computing devices providing environmental protection and structural integrity.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Weight | 2.5-8.5 kg depending on size | |
| Cooling | Passive or forced air (fan options) | |
| Mounting | DIN rail, panel, or wall mount | |
| IP Rating | IP65/IP67 | |
| Dimensions | Standard 19" rack mount (1U-4U variants) | |
| NEMA Rating | NEMA 4X | |
| EMI Shielding | ≥40 dB attenuation (30 MHz - 1 GHz) | |
| Shock Resistance | 50G, 11ms half-sine | |
| Vibration Resistance | 5-500 Hz, 5G RMS | |
| Operating Temperature | -40°C to +85°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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This enclosure is designed for harsh industrial environments including dust, water jets (IP65/IP67), temperature extremes (-40°C to +85°C), vibration (5G RMS), shock (50G), and electromagnetic interference (≥40 dB attenuation).
Thermal management is achieved through passive cooling with heat-conductive aluminum construction, optional heat pipes, and forced air cooling with filtered intake/exhaust fans. Some models include thermal interface materials for efficient heat transfer from internal components.
Yes, modular designs allow for customization including additional mounting points, specialized connectors, viewing windows, status indicators, and specific material finishes to meet application requirements.
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