Substrate/Disc Body: Diameter 100-500 mm, Thickness 10-50 mm

Q: What is the primary function of the Substrate/Disc Body?

It provides structural support for the sputtering target material and efficiently dissipates heat generated during the PVD process to prevent target degradation.

Q: Why is copper commonly used for this component?

Copper offers excellent thermal conductivity (>400 W/m·K) and good machinability, making it ideal for heat dissipation in high-power sputtering applications.

Component Specifications

Definition

The Substrate/Disc Body is a precision-engineered metallic component that serves as the backbone of anode disc/target assemblies in PVD coating systems. It functions as the mounting platform for sputtering target materials (typically metals or ceramics) and ensures efficient heat dissipation during high-power deposition processes. This component maintains dimensional stability under thermal cycling and mechanical stress while providing reliable electrical connectivity.

Working Principle

The Substrate/Disc Body operates on principles of thermal conduction and mechanical support. During sputtering, it transfers heat away from the target material through its engineered geometry and material properties, preventing thermal runaway. Its flat surface ensures uniform target material bonding, while its structural integrity maintains vacuum seal compatibility in the deposition chamber.

Materials

High-purity oxygen-free copper (C10100/C10200), aluminum alloys (6061-T6), or stainless steel (316L) with thermal conductivity >200 W/m·K. Copper variants often include diffusion-bonded backing plates for enhanced bonding.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Diameter	100-500 mm
Flatness	<0.05 mm
Thickness	10-50 mm
Surface Roughness	Ra < 0.8 μm
Thermal Conductivity	>200 W/m·K
Water Cooling Channels	Standard (for high-power applications)
Maximum Operating Temperature	300°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ASTM B152, SEMI F47

Parent Products

This component is used in the following industrial products

Anode Disc/Target

The rotating disc-shaped target material in X-ray tubes that emits X-rays when bombarded by electrons.

View Product Details

Engineering Analysis

Risks & Mitigation

Thermal stress cracking
Target material delamination
Cooling channel corrosion
Electrical arcing at interfaces

FMEA Triads

Trigger: Insufficient cooling flow
Failure: Target overheating and premature failure
Mitigation: Implement flow sensors and thermal monitoring with automatic shutdown protocols

Trigger: Poor surface preparation
Failure: Target material bonding failure
Mitigation: Standardize surface cleaning procedures and implement bond strength testing

Trigger: Material impurities
Failure: Reduced thermal conductivity and outgassing
Mitigation: Source materials from certified suppliers with material traceability

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1 mm dimensional, ±0.05° flatness

Test Method

Helium leak testing (<1×10⁻⁹ mbar·L/s), thermal cycling (100 cycles), ultrasonic bond testing

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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Manufacturers of Substrate/Disc Body

Manufacturer profiles associated with Substrate/Disc Body.

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Frequently Asked Questions

What is the primary function of the Substrate/Disc Body?

It provides structural support for the sputtering target material and efficiently dissipates heat generated during the PVD process to prevent target degradation.

Why is copper commonly used for this component?

Copper offers excellent thermal conductivity (>400 W/m·K) and good machinability, making it ideal for heat dissipation in high-power sputtering applications.

How does this component affect coating quality?

Proper thermal management through the Substrate/Disc Body ensures consistent target erosion rates, leading to uniform film thickness and improved coating adhesion.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Substrate/Disc Body