Target Layer: Grain Size 10-100 μm, Diameter 50-450 mm

Component Specifications

Definition

In physical vapor deposition (PVD) systems, the target layer is the precisely engineered material disc mounted in the cathode assembly that undergoes ion bombardment during sputtering. This controlled erosion releases atoms or molecules that travel through the vacuum chamber to deposit as thin films on substrates, enabling the creation of functional coatings in semiconductor, display, and optical applications.

Working Principle

When high-energy ions (typically argon) bombard the target surface in a vacuum environment, momentum transfer causes atoms from the target material to be ejected through physical collision. These ejected atoms travel through the chamber and condense on substrates, forming thin films with controlled thickness and composition.

Materials

High-purity metals (Al, Cu, Ti, Mo, W), alloys (Al-Cu, Ti-W), ceramics (ITO, SiO2, Al2O3), or compounds with purity levels typically 99.95%-99.999% (3N5-5N), depending on application requirements.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Purity	99.95%-99.999%
Bonding	Brazed or diffusion-bonded to backing plate
Density	≥95% theoretical
Diameter	50-450 mm
Thickness	3-20 mm
Grain Size	10-100 μm

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ASTM F3091, SEMI Standards

Parent Products

This component is used in the following industrial products

Anode Disc/Target

The rotating disc-shaped target material in X-ray tubes that emits X-rays when bombarded by electrons.

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Engineering Analysis

Risks & Mitigation

Arcing causing film defects
Thermal cracking from poor cooling
Non-uniform erosion reducing utilization
Contamination from impurities

FMEA Triads

Trigger: Insufficient cooling or bonding defects
Failure: Thermal stress cracking
Mitigation: Implement thermal monitoring, ensure proper bonding quality control, and optimize cooling design

Trigger: Material impurities or microstructure defects
Failure: Particle generation and film contamination
Mitigation: Enhance material purification processes, implement strict quality inspection, and control grain structure

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Diameter: ±0.5 mm, Thickness: ±0.1 mm, Flatness: ≤0.05 mm, Surface roughness: Ra ≤0.8 μm

Test Method

Ultrasonic testing for bonding integrity, EDX for composition analysis, metallographic examination for microstructure

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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Manufacturers of Target Layer

Manufacturer profiles associated with Target Layer.

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Frequently Asked Questions

What determines target layer lifespan?

Lifespan depends on material properties, sputtering power, erosion uniformity, and cooling efficiency. Typical targets achieve 80-90% utilization before replacement.

How are target layers bonded to backing plates?

Through brazing with high-conductivity alloys or diffusion bonding under heat and pressure to ensure optimal thermal transfer and mechanical stability.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Target Layer