Via: Current Capacity 1-3 A, Diameter 0.1-0.5 mm

Q: What are the main types of vias in PCB design?

Through-hole vias (connect all layers), blind vias (connect outer to inner layers), buried vias (connect only inner layers), and microvias (for high-density interconnect).

Q: What causes via failure in PCBs?

Thermal stress from coefficient of thermal expansion mismatch, plating voids, drill misalignment, and electrochemical migration.

Component Specifications

Definition

A via is a plated-through hole in a printed circuit board (PCB) that provides electrical connectivity between different conductive layers. It consists of a cylindrical hole drilled through the PCB substrate, with electroplated copper forming a conductive lining that connects the copper traces on different layers. Vias are essential for creating multi-layer PCB designs, enabling complex routing in modern electronic devices.

Working Principle

Electrical conduction through a plated metal cylinder that bridges conductive layers separated by insulating dielectric material, allowing signals and power to pass vertically through the PCB stackup.

Materials

Copper plating (typically 1-2 oz/ft²), with possible nickel/gold finish for surface protection; substrate: FR-4, polyimide, or other PCB dielectric materials.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Diameter	0.1-0.5 mm
Resistance	< 50 mΩ
Aspect Ratio	Up to 10:1
Current Capacity	1-3 A
Plating Thickness	25-50 μm

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IPC-6012, IPC-A-600

Parent Products

This component is used in the following industrial products

Interconnect Matrix

A structured network of conductive pathways within a logic gates array that enables signal routing and electrical connections between individual logic gates.

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Engineering Analysis

Risks & Mitigation

Thermal stress failure
Plating voids
Signal integrity degradation
Manufacturing defects

FMEA Triads

Trigger: Thermal cycling during operation
Failure: Via barrel cracking
Mitigation: Use compatible CTE materials, adequate plating thickness, and thermal relief pads

Trigger: Poor plating process
Failure: Incomplete conductivity
Mitigation: Implement strict process controls, regular inspection, and quality testing

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.05 mm diameter, ±0.1 mm position

Test Method

Cross-section microscopy, electrical continuity testing, thermal cycling tests

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

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Manufacturers of Via

Manufacturer profiles associated with Via.

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Frequently Asked Questions

What are the main types of vias in PCB design?