Via structures are conductive pathways in printed circuit boards that enable vertical electrical connections between different layers.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Diameter | 0.1-0.5 mm | |
| Resistance | < 10 mΩ per via | |
| Aspect Ratio | Up to 10:1 | |
| Current Capacity | 1-5 A depending on size | |
| Plating Thickness | 15-50 μm | |
| Thermal Conductivity | 400 W/m·K (copper) | |
| Operating Temperature | -55°C to +125°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A specialized circuit board within a probe card interface that transmits electrical signals between the test equipment and semiconductor wafer during testing.
A printed circuit board substrate made from ceramic materials instead of traditional FR-4 or other organic laminates.
A specialized printed circuit board designed to operate at radio frequencies for wireless communication applications.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Via Structures.
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The main types are through-hole vias (connecting all layers), blind vias (connecting outer to inner layers), buried vias (connecting only inner layers), and microvias (diameter < 0.15 mm for high-density interconnects).
Via structures can introduce impedance discontinuities, signal reflections, and crosstalk if not properly designed. Controlled impedance vias, back-drilling, and via stitching techniques help maintain signal integrity in high-frequency applications.
Common failure mechanisms include thermal cycling stress causing barrel cracking, electrochemical migration, copper fatigue from vibration, and plating voids that reduce current-carrying capacity.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.