Bottom-side and double-sided AOI system for through-hole solder joints

01

Check solder-side clearance and what the bottom head looks for

Reaching describes its inverted-camera AOI-V5200 series as installed at the bottom side of the line to inspect post-reflow and wave-soldered joints, THT components and odd-form parts without flipping the PCB; it lists top clearance of 120 mm and bottom clearance adjustable from 25 to 50 mm. [1]

Its double-sided VS5300 series inspects top and bottom surfaces in one pass; the data table for its VS300 and VS300XL models gives component clearance of 25–85 mm on top and 25–80 mm underneath. [2] Mek's ISO-Spector X1, a bottom-up 3D AOI designed for post-wave and selective soldering, offers 100 mm (3.9 in) of THT solder-side clearance and a 60 × 60 mm field of view, according to the launch report in Electronics For You. [3]

The defect lists show what the solder-side view adds. Reaching's wave-solder algorithm checks for insufficient solder, missing pins and blowholes on manually or machine-inserted through-hole parts. [1] Mek states that the X1 captures volumetric data for each solder joint and pin to detect pin height variations, annular ring coverage and blow holes. [3]

Editorial note: measure the longest pin protrusion, any selective-solder pallet or carrier, and the tallest bottom-side part, and compare them with the bottom clearance of the machine before asking for a demonstration.

Give the supplier board size and thickness, longest pin protrusion below the board, pallet or carrier height, top and bottom component heights, board temperature and weight at the AOI, soldering process (wave or selective), defects to detect, cycle time, and line interface (SMEMA, MES).

02

Match the transport to hot and heavy boards, then estimate board time

Boards leaving a wave or selective solder machine may still be warm and may ride on heavy carriers, so the conveyor limits matter. Reaching's VS300 data table allows boards up to 10 kg at up to 60 °C on the standard belt, rising to 30 kg and 150 °C with the optional roller pulley; its inverted V5200 uses roller-pulley transport with a 3.0 kg board weight limit. [2] [1]

Both Reaching series use 5 MP or 12 MP cameras with telecentric lenses and four-colour (RGBW) ring LEDs, with a field of view of 60 × 49 mm at 24 µm (5 MP) or 60 × 45 mm at 15 µm (12 MP). Inspection takes 200–250 ms per field of view on the double-sided VS300 and 180–200 ms on the V5200. [2] [1] Mek's X1 accepts boards up to 550 × 550 mm, including pallets. [3]

Editorial calculation (assumptions: a full 510 × 510 mm board, 60 × 49 mm fields tiled without overlap, motion and board transfer time ignored): 510 ÷ 60 = 8.5, so 9 columns; 510 ÷ 49 = 10.4, so 11 rows; 9 × 11 = 99 fields × 0.20–0.25 s = about 20–25 s of imaging per side on the VS300. Ask the supplier to time your own board, since through-hole boards may only need the solder-joint areas imaged.

03

Compare inverted, double-sided and 3D bottom-up designs

04

Bottom head, top head, RGBW lighting, 3D height sensing and roller conveyor

05

Field of view, pixel resolution, board temperature and weight for a solder-side AOI

Throughput is not published as boards per hour: the Reaching tables give 180–250 ms per field, so the rate depends on how many fields your board needs. Humidity range and IP rating are not stated in the reviewed sources.

06

Send the board, solder process and line data together

Paste it into your enquiry below or into an email to a maker, then replace every bracket.

Board: [size; thickness; weight with pallet]
Solder side: [longest pin; pallet height; bottom parts]
Process: [wave or selective; board temperature at AOI]
Inspection: [bottom only or double-sided; 2D or 3D; defects]
Line: [cycle time; SMEMA; MES; barcode]
Site: [power; floor space; conveyor height]

See manufacturer records Send an enquiry through CNFX