Automated Die Attach Machine

Product Specifications

Technical details and manufacturing context for Automated Die Attach Machine

Definition

An automated die attach machine is a precision industrial device used in electronic component manufacturing to accurately place semiconductor dies onto leadframes, substrates, or packages. It performs critical bonding operations using epoxy, solder, or conductive adhesives to create permanent electrical and mechanical connections. The machine ensures high placement accuracy and consistent bond quality for various die sizes and package types. Advanced models incorporate vision systems for alignment verification and process monitoring to maintain production yield. The machine typically features a robotic pick-and-place mechanism with precision motion control, capable of handling dies from wafer tape and placing them with high accuracy. It uses optical recognition for alignment and applies bonding methods such as thermal, ultrasonic, or pressure-based attachment. Key parameters include placement accuracy of ±0.05 mm (3σ), throughput of 3000–8000 UPH, bond force adjustable from 0.5 to 50 N, temperature control of ±2 °C, die size range from 0.2×0.2 mm² to 20×20 mm², vision resolution of 0.01 pixels, substrate size up to 300×300 mm, cycle time of 0.45–1.2 seconds per die, power supply of 220 V AC ±10%, 50/60 Hz (three-phase optional), air supply of 0.5–0.7 MPa clean dry air filtered to 5 μm, operating temperature of 15–35 °C, humidity range of 30–70% RH non-condensing, machine weight of 1200–1800 kg, and footprint of 1800×1500 mm (width × depth, excluding operator console). The machine is constructed with stainless steel, aluminum alloy, ceramic components, and polymer seals. It is designed for use in cleanroom environments and requires regular maintenance to ensure consistent performance. For specific model configurations, verify all values and standards with the legal manufacturer or supplier.

Working Principle

The machine uses a robotic pick-and-place mechanism with precision motion control. Dies are picked from wafer tape, aligned to target positions using optical recognition, and bonded using thermal, ultrasonic, or pressure-based methods. The process involves precise movement and force application to ensure accurate placement and reliable bonding.

Common Materials

Stainless Steel, Aluminum Alloy, Ceramic Components, Polymer Seals

Technical Parameters

Parameter	Typical range	Notes & selection driver
Placement AccuracyRequired	±0.05 μm	3σ positioning accuracy
ThroughputRequired	3000–8000 UPH	Maximum units per hour
Bond ForceRequired	0.5–50 N	Adjustable bonding force
Temperature ControlRequired	±2 °C	Heating stage temperature range
Die Size RangeRequired	0.2×0.2 – 20×20 mm²	Minimum to maximum die area
Vision Resolution	0.01 pixels	Camera system resolution
Substrate Size	Up to 300×300 mm	Maximum lead frame or substrate dimensions
Cycle Time	0.45–1.2 s	Per die, including vision and bonding
Power Supply	220 V AC ±10%, 50/60 Hz	Three-phase optional
Air Supply	0.5–0.7 MPa	Clean dry air, filtered to 5 μm
Operating Temperature	15–35 °C	For specified accuracy
Humidity Range	30–70 % RH	Non-condensing
Machine Weight	1200–1800 kg	Depending on configuration
Footprint	1800×1500 mm	Width × depth, excluding operator console

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Pickup Head
Vacuum-based die extraction from wafer

Material: Ceramic/Tungsten Carbide
Bonding Tool
Applies force and heat for attachment

Material: Hardened Steel
Vision Alignment System
Optical recognition for precise positioning

Material: Glass Lenses, CCD Sensors
Heating Stage
Thermal management for bonding process

Material: Aluminum with Heating Elements
Dispenser Unit Optional
Applies adhesive or epoxy to substrate

Material: Stainless Steel, PTFE
Precision Motion Stage
Carries the pickup head between wafer and substrate at placement accuracy.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Automated Die Attach Machine.

Manufacturers of Automated Die Attach Machine

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

UVLEDTEK

Shanghai, CN

Also makes: Receiver/Detector Module, Test Chamber, Drying Oven and 2 more

Listed on the company's own website · profile compiled by CNFX from public sources

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Frequently Asked Questions

What is the placement accuracy of this die attach machine?

The placement accuracy is ±0.05 μm (3σ), as listed in the directory. However, this value is a reference range and must be confirmed for the specific model and application with the legal manufacturer or supplier.

What bonding methods does the machine support?

The machine supports bonding using epoxy, solder, or conductive adhesives. The actual method depends on the configuration and must be verified with the manufacturer.

What is the maximum substrate size it can handle?

The maximum substrate size is up to 300×300 mm, as per the directory. Confirm the exact capability for your intended substrate with the supplier.

What are the environmental requirements for operation?

The machine operates in temperatures of 15–35 °C and humidity of 30–70% RH non-condensing. It requires clean dry air at 0.5–0.7 MPa filtered to 5 μm. Always verify these requirements with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	0.1-10 N (bonding force range), 0.5-5 bar (vacuum/pressure system)
throughput:	5,000-30,000 UPH (units per hour)
temperature:	15-30°C (operating environment), 150-300°C (bonding temperature range)
substrate size:	50-300 mm (handling capability)
placement accuracy:	±1.5-5 μm (die placement accuracy)

Product Specifications

Industry Taxonomies & Aliases

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards