Editorial Technical Reference

Buffer Memory Array

This page explains how Buffer Memory Array is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A dedicated memory component within a Buffer Manager that temporarily stores data during transfer operations between different system components or processing stages.

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Product Specifications

Technical details and manufacturing context for Buffer Memory Array

Definition

The Buffer Memory Array is a critical sub-component of the Buffer Manager system, functioning as a temporary data storage area that holds information during transfer operations between different system modules, processing units, or I/O devices. It enables smooth data flow by compensating for speed mismatches between components, preventing data loss, and ensuring continuous operation during peak load conditions. The array is typically implemented using semiconductor silicon with copper interconnects and dielectric materials, and is available in a BGA-64 package (JEDEC MO-275) with a 10×10 mm footprint. Key parameters include a storage capacity of 1–64 MB, a data transfer rate of 100–400 MB/s, and an access time of 10–50 ns. The operating voltage is 3.3 V ±5%, with power consumption ranging from 0.5 to 2.5 W in active mode. It is designed for industrial-grade operation over -40 to 85 °C, with storage temperature from -55 to 125 °C and non-condensing relative humidity of 5–95%. The array offers write endurance of 10^5–10^6 cycles and data retention of 10–20 years at 85 °C. These values are reference ranges and must be confirmed for the specific model and application. The Buffer Memory Array is a component intended for integration into larger systems; it is not a standalone end-user product. For procurement and verification, consult the legal manufacturer or supplier to confirm model-specific specifications and compliance with applicable standards.

Working Principle

The Buffer Memory Array operates by receiving data from a source component at its output rate, storing it temporarily in organized memory cells, and then releasing it to the destination component at the appropriate rate. It typically uses addressable memory architecture with read/write controllers that manage data flow based on buffer status indicators (full/empty thresholds). The array may implement FIFO (First-In-First-Out), LIFO (Last-In-First-Out), or circular buffer organization depending on the application requirements. This mechanism compensates for speed mismatches and ensures data integrity during transfers.

Common Materials

Semiconductor silicon, Copper interconnects, Dielectric materials

Technical Parameters

Parameter	Typical range	Notes & selection driver
Storage Capacity	1–64 MB	Total buffer size per array
Data Transfer Rate	100–400 MB/s	Sustained throughput
Access Time	10–50 ns	Random read/write latency
Operating Voltage	3.3 ±5% V	Core and I/O supply
Power Consumption	0.5–2.5 W	Active mode
Operating Temperature	-40–85 °C	Industrial grade
Storage Temperature	-55–125 °C	Non-operating
Relative Humidity	5–95 %	Non-condensing
Endurance	10^5–10^6 cycles	Write endurance
Data Retention	10–20 years	At 85°C
Package Type	BGA-64	Ball grid arrayJEDEC MO-275
Footprint	10×10 mm	Package size

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Memory Cells Part
Individual storage elements that hold binary data (0 or 1)

Material: Semiconductor materials
Address Decoder Part
Selects specific memory cells for read/write operations based on address inputs

Material: Semiconductor materials
Read/Write Controller
Manages data flow direction and timing for memory operations

Material: Semiconductor materials
Buffer Status Logic Part
Monitors fill level and generates full/empty signals for flow control

Material: Semiconductor materials

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Buffer Manager

View system integration details

Manufacturers of Buffer Memory Array

Manufacturer profiles associated with Buffer Memory Array.

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Frequently Asked Questions

What is the primary function of a Buffer Memory Array?

It temporarily stores data during transfers between system components, compensating for speed mismatches and preventing data loss.

What are the typical storage capacities available?

The reference range is 1 to 64 MB, but the exact capacity depends on the specific model and must be confirmed with the manufacturer.

What operating temperature range is supported?

The industrial-grade operating temperature range is -40 to 85 °C, with storage temperature from -55 to 125 °C.

How does the buffer organization affect performance?

FIFO, LIFO, or circular buffer organizations are used depending on the application. Each has different implications for data ordering and overwrite behavior, so selection should match the system requirements.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	N/A (solid-state component)
other spec:	Data transfer rate: Up to 3200 MT/s, Power consumption: 1.2V nominal, 1.35V max
temperature:	0°C to 70°C (operational), -40°C to 85°C (storage)