This page explains how Bus Interface Unit is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A hardware component within a DMA engine that manages data transfer between the DMA controller and the system bus.
Technical details and manufacturing context for Bus Interface Unit
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Bus Interface Type | PCIe Gen3 x4 | Determines maximum data transfer rate and compatibility with host system.PCIe Base Specification 3.0 |
| Data Transfer Rate | 32 Gbit/s | Aggregate bandwidth for PCIe Gen3 x4; higher rates require newer interface. |
| Bus Width | 32 bit | Width of the data bus; wider buses allow more data per transaction. |
| Operating Voltage | 3.3 V ±5% V | Supply voltage for interface logic; out of range may cause malfunction.PCIe CEM specification |
| Operating Temperature | 0–70 °C | Commercial grade; extended ranges available for industrial.IEC 60068-2-1, IEC 60068-2-2 |
| Storage Temperature | -40–85 °C | Non-operating condition; ensures reliability during transport.IEC 60068-2-1, IEC 60068-2-2 |
| Relative Humidity | 5–95 % | Non-condensing; condensation may cause short circuits.IEC 60068-2-78 |
| Power Consumption | 2.5–5.0 W | Depends on data rate and activity; affects thermal design. |
| Signal Integrity | ≤ -20 dB return loss dB | Ensures reliable high-speed data transmission.PCIe Base Specification 3.0 |
| Latency | ≤ 500 ns | Time from request to data availability; critical for real-time systems. |
| Package Type | BGA-256 | Ball grid array for high pin count and thermal performance.JEDEC MS-028 |
| Weight | 5–10 g | Varies with package and heat sink; affects PCB mechanical design. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| voltage: | 3.3V ±10% (typical), 1.8V to 5V (range) |
| temperature: | 0°C to 70°C (operational), -40°C to 85°C (storage) |
| clock frequency: | Up to 200 MHz (max bus speed) |
| power consumption: | ≤ 500 mW (typical active) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Bus Interface Unit.
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The Bus Interface Unit (BIU) manages data transfer between the DMA controller and the system bus. It executes bus transactions (read/write cycles) initiated by the DMA controller to transfer data directly between memory and I/O devices without CPU intervention.
Typical specifications include bus interface type (e.g., PCIe Gen3 x4), data transfer rate (up to 32 Gbit/s), bus width (32 bit), operating voltage (3.3 V ±5%), operating temperature (0–70 °C), storage temperature (-40–85 °C), relative humidity (5–95%), power consumption (2.5–5.0 W), signal integrity (≤ -20 dB return loss), latency (≤ 500 ns), package type (BGA-256), and weight (5–10 g). These are reference ranges; verify with the manufacturer.
The BIU arbitrates for control of the system bus, generates address and control signals, manages timing and handshaking, and handles error signals according to the bus protocol (e.g., AXI, AHB, PCIe). It completes transfer cycles and signals back to the DMA controller.
Relevant standards include PCIe Base Specification 3.0, PCIe CEM specification, IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78, and JEDEC MS-028. These are references for verification, not proof of compliance.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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