Industry-Verified Manufacturing Data (2026)

Computer Server Backplane Connector Assembly

Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Computer Server Backplane Connector Assembly used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Computer Server Backplane Connector Assembly is characterized by the integration of Contact Pin Array and Housing Body. In industrial production environments, manufacturers listed on CNFX commonly emphasize Phosphor Bronze Alloy construction to support stable, high-cycle operation across diverse manufacturing scenarios.

High-density interconnect assembly for server motherboard-to-peripheral communication

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Product Specifications

Technical details and manufacturing context for Computer Server Backplane Connector Assembly

Definition
A precision-engineered backplane connector assembly that provides the physical and electrical interface between a server motherboard and peripheral expansion cards, storage drives, or network modules. It enables high-speed data transfer, power delivery, and signal integrity across multiple connection points within server chassis. These components are critical for modular server architectures where hot-swappable functionality and reliable connectivity are essential for data center operations.
Working Principle
Utilizes multiple precision-machined contact pins arranged in specific patterns to establish electrical connections when mated with corresponding sockets. The assembly maintains signal integrity through controlled impedance pathways and provides mechanical alignment for proper card insertion and retention.
Common Materials
Phosphor Bronze Alloy, High-Temperature Liquid Crystal Polymer (LCP), Nickel-Plated Steel
Technical Parameters
  • Total number of contact positions (positions) Per Request
  • Pitch spacing between contacts (mm) Per Request
Components / BOM
  • Contact Pin Array
    Provides electrical connection points
    Material: Phosphor Bronze with Gold Plating
  • Housing Body
    Structural support and alignment
    Material: High-Temperature LCP
  • Retention Clip
    Secures connector to PCB
    Material: Nickel-Plated Steel
  • EMI Shield Optional
    Electromagnetic interference protection
    Material: Zinc Alloy
Engineering Reasoning
0-3.5 Gbps per lane differential signaling, 0-85°C ambient temperature, 0-95% relative humidity non-condensing
Signal integrity degradation beyond -6 dB insertion loss at 8 GHz, contact resistance exceeding 50 mΩ per mated pair, mechanical deflection exceeding 0.15 mm under 50 N mating force
Design Rationale: Electromigration at current densities exceeding 10⁶ A/cm² causing contact degradation, dielectric breakdown at electric fields exceeding 15 kV/mm in FR-4 substrate, thermal expansion mismatch (CTE 18 ppm/°C for copper vs 50 ppm/°C for LCP housing) causing mechanical stress
Risk Mitigation (FMEA)
Trigger Electrochemical migration due to ionic contamination exceeding 1.56 μg/cm² NaCl equivalent
Mode: Insulation resistance dropping below 10⁸ Ω at 100 VDC, leading to signal crosstalk exceeding -30 dB
Strategy: Conformal coating with parylene-C (2.5 μm thickness) achieving 10¹⁶ Ω·cm volume resistivity
Trigger Contact fretting wear under vibration exceeding 10 g RMS at 2000 Hz
Mode: Contact resistance instability exceeding ±20% from initial 15 mΩ value
Strategy: Gold-over-nickel plating (0.76 μm Au, 1.27 μm Ni) with lubricant film (PFPE, 0.1 μm thickness) reducing wear coefficient to 10⁻⁷

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Computer Server Backplane Connector Assembly.

server backplane interconnect high-density server connector motherboard expansion connector high-density server backplane connector assembly phosphor bronze computer server connector LCP housing backplane connector server motherboard peripheral communication connector EMI shield server connector assembly

Industrial Ecosystem & Supply Chain DNA

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (electrical connector, not fluid handling)
other spec: Current rating: 1A per contact, Voltage rating: 50V AC/DC, Contact resistance: <20mΩ, Insulation resistance: >1000MΩ
temperature: -40°C to +105°C
Media Compatibility
✓ Server-grade PCB materials (FR-4, Rogers) ✓ Copper alloy contacts with gold plating ✓ Standard server cooling air environments
Unsuitable: High-vibration industrial environments without additional mechanical support
Sizing Data Required
  • Number of required signal/power contacts
  • Required data transfer rate (Gbps per lane)
  • Physical space constraints and connector footprint

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Contact fretting corrosion
Cause: Micro-motion from thermal cycling or vibration causes wear on connector pins, leading to oxide buildup and increased electrical resistance.
Intermittent connection failure
Cause: Improper seating during assembly, thermal expansion mismatch, or mechanical stress causing pin misalignment and signal disruption.
Maintenance Indicators
  • Visible discoloration, oxidation, or burn marks on connector pins during inspection
  • Intermittent system errors, data corruption, or unexpected reboots correlated with vibration or temperature changes
Engineering Tips
  • Implement periodic infrared thermography scans to detect abnormal heat patterns at connector junctions indicating high resistance
  • Use torque-controlled installation tools and alignment guides during assembly/replacement to ensure proper seating and prevent mechanical stress

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 Quality Management Systems ANSI/EIA-364-E Electrical Connector Test Procedures DIN 41612 Connectors for Printed Boards
Manufacturing Precision
  • Contact Pitch: +/-0.05mm
  • Insertion Force: +/-10% of specified value
Quality Inspection
  • Contact Resistance Test
  • Dimensional Verification via CMM

Factories Producing Computer Server Backplane Connector Assembly

Verified manufacturers with capability to produce this product in China

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✓ 92% Supplier Capability Match Found

P Project Engineer from United States Jan 14, 2026
★★★★★
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The Computer Server Backplane Connector Assembly arrived with full certification."
Technical Specifications Verified
S Sourcing Manager from United Arab Emirates Jan 11, 2026
★★★★★
"Great transparency on the Computer Server Backplane Connector Assembly components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
Technical Specifications Verified
P Procurement Specialist from Australia Jan 08, 2026
★★★★★
"The Computer Server Backplane Connector Assembly we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."
Technical Specifications Verified
Verification Protocol

“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”

8 sourcing managers are analyzing this specification now. Last inquiry for Computer Server Backplane Connector Assembly from Mexico (1h ago).

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Frequently Asked Questions

What are the key benefits of using phosphor bronze alloy in this server backplane connector?

Phosphor bronze alloy provides excellent spring properties, corrosion resistance, and reliable electrical conductivity, ensuring durable performance in high-density server applications with repeated mating cycles.

How does the high-temperature LCP housing material improve connector performance?

High-temperature Liquid Crystal Polymer (LCP) offers superior dimensional stability, excellent dielectric properties, and resistance to thermal deformation, maintaining reliable connections in server environments with elevated operating temperatures.

What applications is this backplane connector assembly designed for in computer manufacturing?

This assembly is engineered for server motherboard-to-peripheral communication in data centers, enterprise servers, and high-performance computing systems, supporting reliable high-speed data transfer and power distribution between components.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data Specifications verified by CNFX Industrial Index (v2.6.03) for Computer, Electronic and Optical Product Manufacturing sector.

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