Industry-Verified Manufacturing Data (2026)

Driver/Receiver IC

Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Driver/Receiver IC used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Driver/Receiver IC is characterized by the integration of Input Protection Circuit and Driver Stage. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon construction to support stable, high-cycle operation across diverse manufacturing scenarios.

An integrated circuit that amplifies and conditions signals for transmission and reception in electronic systems.

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Product Specifications

Technical details and manufacturing context for Driver/Receiver IC

Definition
A specialized integrated circuit within Input/Output Interface Circuits that serves dual functions: as a driver, it amplifies and buffers low-power control signals to provide sufficient current/voltage for driving external loads like motors, displays, or communication lines; as a receiver, it conditions incoming signals by amplifying, filtering, and converting them to logic levels suitable for processing by microcontrollers or other digital circuits.
Working Principle
Operates by receiving low-power digital or analog input signals, amplifying them through internal transistor arrays and operational amplifiers, and outputting strengthened signals capable of driving external components. In receiver mode, it uses input protection circuits, signal conditioning stages, and level shifters to convert incoming signals to compatible logic levels while providing noise immunity and impedance matching.
Common Materials
Silicon, Copper, Aluminum, Plastic/Epoxy
Technical Parameters
  • Operating voltage range (V) Standard Spec
Components / BOM
  • Input Protection Circuit
    Protects against electrostatic discharge and voltage spikes
    Material: Silicon diodes/transistors
  • Driver Stage
    Amplifies input signals to drive external loads
    Material: Bipolar/CMOS transistors
  • Receiver Stage
    Conditions incoming signals to logic-compatible levels
    Material: Operational amplifiers/comparators
  • Output Stage
    Provides current sourcing/sinking capability
    Material: Power transistors
  • Package
    Protects silicon die and provides electrical connections
    Material: Plastic/epoxy with copper leads
Engineering Reasoning
0.8-5.5 V input voltage, -40 to 125 °C junction temperature, 50 Ω impedance matching
Input voltage exceeding 6.0 V causes gate oxide breakdown, junction temperature above 150 °C initiates thermal runaway
Design Rationale: Electromigration in aluminum interconnects at current densities > 1×10⁶ A/cm², hot carrier injection at electric fields > 5×10⁵ V/cm
Risk Mitigation (FMEA)
Trigger Electrostatic discharge (ESD) event exceeding 2 kV HBM
Mode: Gate oxide rupture in input protection diodes
Strategy: Integrated silicon-controlled rectifier (SCR) clamps with 1.5 kV protection rating
Trigger Simultaneous switching noise generating 200 mV ground bounce
Mode: Timing violation causing data corruption at 1 Gbps
Strategy: Differential signaling with 100 Ω termination and 50 ps skew matching

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Driver/Receiver IC.

high-speed driver receiver IC for optical systems signal conditioning integrated circuit for computers low-power driver receiver chip for electronics industrial-grade driver receiver IC with input protection surface-mount driver receiver IC for P

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Input/Output Interface Circuits
View system integration details

Industrial Ecosystem & Supply Chain DNA

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
voltage: Supply voltage range: 3V to 5.5V typical, absolute maximum ratings: -0.5V to 7V
temperature: -40°C to +125°C (operating), -65°C to +150°C (storage)
signal characteristics: Data rate: up to 20 Mbps, common-mode voltage range: -7V to +12V, ESD protection: ±15kV HBM
Media Compatibility
✓ RS-485/RS-422 communication systems ✓ Industrial automation networks ✓ Motor control feedback systems
Unsuitable: High-voltage power transmission environments (>1000V)
Sizing Data Required
  • Required data transmission rate (bps)
  • Maximum transmission distance (meters)
  • Number of nodes in the network

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Overheating and thermal runaway
Cause: Excessive current draw, poor heat dissipation, or ambient temperature exceeding IC specifications leading to junction temperature rise and eventual thermal shutdown or permanent damage.
Electrostatic discharge (ESD) damage
Cause: Improper handling during installation or maintenance without ESD protection, causing latent or immediate failure of sensitive internal semiconductor structures.
Maintenance Indicators
  • Audible high-pitched whine or buzzing from the IC or nearby components indicating oscillation instability or power supply issues
  • Visible discoloration, bulging, or charring on the IC package or PCB area, signaling overheating or electrical overstress
Engineering Tips
  • Ensure proper thermal management by verifying heatsink attachment, thermal interface material application, and maintaining adequate airflow around the IC during installation and operation
  • Implement strict ESD control procedures during all handling and maintenance activities, including use of grounded workstations, wrist straps, and proper IC storage containers

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 Quality Management Systems IEC 60747-5-2 Semiconductor devices - Discrete devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics CE Marking (EU Directive 2014/35/EU Low Voltage Directive)
Manufacturing Precision
  • Output Voltage Tolerance: +/-5% of nominal value
  • Propagation Delay: +/-2 ns across operating temperature range
Quality Inspection
  • Automated Optical Inspection (AOI) for solder joints and component placement
  • Environmental Stress Screening (ESS) including temperature cycling and burn-in testing

Factories Producing Driver/Receiver IC

Verified manufacturers with capability to produce this product in China

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✓ 93% Supplier Capability Match Found

T Technical Director from Germany Jan 02, 2026
★★★★★
"Great transparency on the Driver/Receiver IC components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
Technical Specifications Verified
P Project Engineer from Brazil Dec 30, 2025
★★★★☆
"The Driver/Receiver IC we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements. (Delivery took slightly longer than expected, but technical support was excellent.)"
Technical Specifications Verified
S Sourcing Manager from Canada Dec 27, 2025
★★★★★
"Found 58+ suppliers for Driver/Receiver IC on CNFX, but this spec remains the most cost-effective."
Technical Specifications Verified
Verification Protocol

“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”

9 sourcing managers are analyzing this specification now. Last inquiry for Driver/Receiver IC from Mexico (1h ago).

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Frequently Asked Questions

What are the key applications of this Driver/Receiver IC?

This IC is designed for signal transmission and reception in computer peripherals, optical communication systems, industrial automation equipment, and electronic measurement devices where reliable signal conditioning is required.

What input protection features does this Driver/Receiver IC include?

The IC incorporates ESD protection, overvoltage protection, and current limiting circuits to safeguard against electrostatic discharge, voltage spikes, and short-circuit conditions in the input stage.

What packaging options are available for this Driver/Receiver IC?

Available in standard surface-mount packages including SOIC, QFN, and TSSOP with plastic/epoxy encapsulation, featuring copper/aluminum leadframes for optimal thermal and electrical performance.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data Specifications verified by CNFX Industrial Index (v2.6.03) for Computer, Electronic and Optical Product Manufacturing sector.

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