This page explains how Gas Chamber is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
The sealed enclosure within a Gas Discharge Tube (GDT) that contains the ionizable gas mixture.
Technical details and manufacturing context for Gas Chamber
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Gas Volume | 0.5–5.0 cm³ | Determines arc quenching capability |
| Leak Rate | ≤1×10⁻⁹ Pa·m³/s | Ensures long-term gas retentionIEC 60068-2-17 |
| Dielectric Withstand Voltage | ≥500 V DC | Minimum insulation between electrodesIEC 60112 |
| Insulation Resistance | ≥10¹⁰ Ω | At 100 V DCIEC 60112 |
| Capacitance | 0.5–2.0 pF | Affects high-frequency performance |
| Operating Temperature Range | -40–85 °C | Outside this range gas may condense or degradeIEC 60068-2-1, IEC 60068-2-2 |
| Storage Temperature Range | -55–125 °C | For long-term shelf lifeIEC 60068-2-1, IEC 60068-2-2 |
| Relative Humidity | 5–95 % RH | Non-condensingIEC 60068-2-78 |
| Material | Al₂O₃ (96%) | High-purity alumina ceramicASTM F961 |
| Weight | 1.5–3.0 g | Depends on size and wall thickness |
| Sealing Method | Glass-to-metal | Hermetic seal integrityIEC 60068-2-17 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | 0.5 to 3.0 bar absolute (typical fill pressure), withstand up to 10 bar burst pressure |
| other spec: | Gas purity: ≥99.99%, Leak rate: <1×10⁻⁸ mbar·L/s, Electrode spacing: 0.5-5.0 mm |
| temperature: | -40°C to +125°C (operating), up to +150°C (peak) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Gas Chamber.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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The gas chamber houses the ionizable gas mixture at controlled pressure. When overvoltage occurs, the gas ionizes to conduct surge current, protecting downstream circuits. After the surge, it de-ionizes to restore high impedance.
Common materials include alumina ceramic, glass, and metal-ceramic composites. High-purity alumina (Al₂O₃ 96%) is often specified, but the exact material depends on the manufacturer's design.
Key parameters include operating pressure (1.0–1.6 MPa), gas volume (0.5–5.0 cm³), leak rate (≤1×10⁻⁹ Pa·m³/s), dielectric withstand voltage (≥500 V DC), insulation resistance (≥10¹⁰ Ω at 100 V DC), capacitance (0.5–2.0 pF), and temperature ranges. Always confirm with the manufacturer.
The gas composition and pressure determine the breakdown voltage and arc quenching capability. The chamber's geometry influences capacitance and high-frequency performance. A leak or contamination can degrade performance, so hermetic sealing is critical.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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