This page explains how Headband Assembly is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Structural component that connects the ear cups and provides adjustable fit for portable Bluetooth noise-cancelling headphones.
Technical details and manufacturing context for Headband Assembly
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Headband Width | 18–22 mm | Affects comfort and clamping force |
| Headband Thickness | 2.0–3.0 mm | Determines structural strength |
| Adjustable Length Range | 30–50 mm | Accommodates different head sizes |
| Clamping Force | 3.0–5.0 N | Ensures stable fit without discomfort |
| Weight | 25–40 g | Contributes to overall headphone weight |
| Operating Temperature | -20–60 °C | Material performance outside this range may degradeIEC 60068-2-1, IEC 60068-2-2 |
| Storage Temperature | -30–70 °C | Prevents warping or brittlenessIEC 60068-2-1, IEC 60068-2-2 |
| Relative Humidity | 10–95 % RH | Non-condensing; affects material stabilityIEC 60068-2-78 |
| Material Hardness | 70–90 Shore A | Softer for comfort, harder for durabilityISO 868 |
| Surface Finish | Ra 0.8–1.6 μm | Aesthetic and tactile qualityISO 4287 |
| Tensile Strength | 40–60 MPa | Ensures structural integrity under stressISO 527-2 |
| Flexural Modulus | 1500–2500 MPa | Affects flexibility and springbackISO 178 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | N/A (non-pressure application) |
| other spec: | Head circumference range: 50-65 cm, Adjustment steps: 10-15 mm increments |
| temperature: | -20°C to +60°C (operating), -30°C to +70°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Headband Assembly.
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It is a structural component that connects the left and right ear cups of portable Bluetooth noise-cancelling headphones, providing a secure and adjustable fit on the user's head.
The materials on file include plastic polymer, stainless steel, memory foam, and synthetic leather. These are typical for such components, but specific grades should be confirmed with the manufacturer.
Reference ranges include headband width 18–22 mm, thickness 2.0–3.0 mm, adjustable length 30–50 mm, clamping force 3.0–5.0 N, and weight 25–40 g. Operating temperature is -20 to 60 °C, storage -30 to 70 °C, and relative humidity up to 95% non-condensing. Material hardness is 70–90 Shore A, surface finish Ra 0.8–1.6 μm, tensile strength 40–60 MPa, and flexural modulus 1500–2500 MPa. These are reference values; verify for your specific model.
The listed standards (e.g., IEC 60068-2-1, ISO 868) are references for testing methods. They do not imply certification. Always request documentation from the legal manufacturer or supplier and confirm that the component meets your application's requirements.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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