Photocoupler Assembly
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This page explains how Molded Package is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A protective housing for photocoupler components formed through injection molding processes.
Technical details and manufacturing context for Molded Package
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Package Length | 4.4–5.2 mm | Standard DIP package dimensions |
| Package Width | 3.5–4.0 mm | Standard DIP package dimensions |
| Package Height | 2.0–2.5 mm | Standard DIP package dimensions |
| Lead Pitch | 2.54 mm | Standard DIP lead spacingIEC 60194 |
| Lead Width | 0.4–0.5 mm | Typical lead width |
| Lead Length | 3.0–3.5 mm | Typical lead length |
| Operating Temperature | -40–85 °C | Extended temperature rangeIEC 60068-2-1 |
| Storage Temperature | -40–100 °C | Non-operating storageIEC 60068-2-2 |
| Humidity | 5–95 % RH | Non-condensingIEC 60068-2-78 |
| Insulation Resistance | ≥10^10 Ω | At 500 V DCIEC 60250 |
| Dielectric Strength | 5 kV | AC 50 Hz, 1 minIEC 60243-1 |
| Creepage Distance | ≥7 mm | For reinforced insulationIEC 60664-1 |
| Clearance Distance | ≥5 mm | For reinforced insulationIEC 60664-1 |
| Weight | 0.3–0.5 g | Typical package weight |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric to 1.5 bar (molded package structural limits) |
| other spec: | Mold flow index: 10-50 g/10min (for injection molding process compatibility) |
| temperature: | -40°C to +125°C (operational range for typical photocoupler applications) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Molded Package.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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Common materials include epoxy resin, silicone, and polycarbonate. These are selected for their insulating properties, thermal stability, and ability to be molded precisely. The specific material grade should be confirmed with the manufacturer for the intended application.
For a standard DIP package, the length is typically 4.4–5.2 mm, width 3.5–4.0 mm, and height 2.0–2.5 mm. Lead pitch is 2.54 mm, lead width 0.4–0.5 mm, and lead length 3.0–3.5 mm. These are reference ranges; actual dimensions may vary by model.
Electrical isolation is achieved through the insulating properties of the molding material and the package design. It is verified by insulation resistance (≥10^10 Ω at 500 V DC) and dielectric strength (5 kV AC for 1 minute) tests per IEC standards. Always verify these parameters for the specific product.
Typical operating temperature is -40 to 85 °C, storage temperature -40 to 100 °C, and humidity 5–95% RH non-condensing. These are based on IEC standards. For extreme conditions, consult the manufacturer for derating or special versions.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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