Editorial Technical Reference

Multiplexer (MUX) / Shift Register

This page explains how Multiplexer (MUX) / Shift Register is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A digital logic component that combines multiplexing and shift register functionality for parallel-to-serial data conversion.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Multiplexer (MUX) / Shift Register

Definition
Within a Serializer (Parallel-in Serial-out) system, this component serves as the core data processing unit. It first multiplexes multiple parallel input channels into a single data stream, then uses shift register functionality to sequentially output the data in serial format, enabling efficient data transmission and interface conversion. The component is designed for use in computer, electronic, and optical product manufacturing, where it facilitates the conversion of parallel data buses to serial interfaces, reducing the number of interconnects and simplifying PCB routing. Typical applications include sensor data acquisition, communication interfaces, and control systems where multiple parallel signals must be transmitted over a limited number of lines. The device integrates two fundamental digital logic functions: a multiplexer that selects one of several input channels based on control signals, and a shift register that stores and shifts data bits synchronously with a clock. This integration allows for compact and efficient data serialization. The component is fabricated on silicon and is available in a standard SOIC-16 package, with other package options possible. Key parameters include a channel count of 8 to 16, a data rate of 10 to 100 Mbps, a supply voltage of 3.3 to 5.0 V, TTL/CMOS input logic levels, a propagation delay of 5 to 20 ns, an operating temperature range of -40 to 85 °C (per IEC 60068-2-1/2), an ESD tolerance of ±2000 V (HBM, per IEC 61000-4-2), a power dissipation of 50 to 200 mW, and an input capacitance of 3 to 10 pF. These values are reference ranges and must be verified for the specific model and application. The component is intended for use in industrial environments, and extended temperature ranges may be available on request. For design and procurement, it is essential to confirm the exact specifications with the legal manufacturer or supplier, as the directory does not guarantee compliance or performance.
Working Principle
The component operates by first selecting between multiple parallel input lines using multiplexer logic based on control signals. The selected parallel data is then loaded into a shift register, where clock signals control the sequential shifting of bits from the parallel register to a single serial output line, converting parallel data to serial format. The multiplexer section uses address or select lines to choose one of the input channels, and the shift register section synchronizes the output with the clock, ensuring proper timing. The process involves loading the parallel data into the register in parallel, then shifting it out bit by bit on each clock pulse. This allows for efficient serialization of data, with the output data rate determined by the clock frequency and the number of bits per frame.
Common Materials
Silicon
Technical Parameters
ParameterTypical rangeNotes & selection driver
Number of Channels8–16 channelsDetermines parallel input width for serial conversion.
Data Rate10–100 MbpsMaximum serial output speed; higher rates require better PCB layout.
Supply Voltage3.3–5.0 VLogic family compatibility; 3.3 V for low power, 5 V for legacy TTL.
Input Logic LevelTTL/CMOSMust match driving device output levels.
Propagation Delay5–20 nsAffects timing margins in high-speed designs.
Operating Temperature-40–85 °CIndustrial grade; extended range available on request.IEC 60068-2-1/2
ESD Tolerance±2000 VHBM model; protects against handling damage.IEC 61000-4-2
Package TypeSOIC-16Common surface-mount package; other options available.JEDEC MS-012
Power Dissipation50–200 mWAt maximum data rate; affects thermal management.
Input Capacitance3–10 pFAffects signal integrity on high-speed lines.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Multiplexer Circuit
    Selects between multiple parallel input channels based on control signals
    Material: silicon
  • Shift Register Array Part
    Stores and sequentially shifts data bits for serial output
    Material: silicon
  • Control Logic Unit
    Manages timing and control signals for multiplexer selection and shifting operations
    Material: silicon
  • Clock Input Buffer Part
    Conditions and distributes clock signals to shift register elements
    Material: silicon

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
voltage: 1.8V to 5.5V (operating range), ±0.5V tolerance
temperature: -40°C to +85°C (industrial grade), -55°C to +125°C (military grade)
clock frequency: DC to 100 MHz (typical), up to 200 MHz (high-speed variants)
power consumption: 10 μW to 50 mW (depending on configuration and speed)
Media Compatibility
✓ Digital control systems ✓ Data acquisition systems ✓ Serial communication interfaces
Unsuitable: High-voltage or high-current switching applications (requires additional drivers)
Sizing Data Required
  • Data width (number of parallel inputs)
  • Required clock frequency/serial data rate
  • Power supply voltage and power budget

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal Degradation
Cause: Contact wear or contamination in switching elements leading to increased resistance and signal loss.
Timing Failure
Cause: Clock signal instability or propagation delay accumulation causing incorrect data shifting or output.
Maintenance Indicators
  • Intermittent or erratic output signals during operation
  • Abnormal heating or audible buzzing from the device
Engineering Tips
  • Implement regular cleaning and inspection of contacts/connectors to prevent contamination buildup
  • Use proper voltage regulation and shielding to maintain stable clock signals and reduce electrical noise

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 60747-14-1:2010 (Semiconductor devices - Part 14-1: Semiconductor sensors - General and classification)

Quoted from the published standard.

Manufacturing Precision
  • Pin-to-pin spacing: +/-0.1mm
  • Signal propagation delay: +/-5% of nominal value
Quality Inspection
  • Electrical continuity and isolation testing
  • Temperature cycling and thermal shock testing

Manufacturers of Multiplexer (MUX) / Shift Register

Manufacturer profiles associated with Multiplexer (MUX) / Shift Register.

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Frequently Asked Questions

What is the primary function of this component?

It converts parallel data from multiple input channels into a serial data stream, using a multiplexer to select channels and a shift register to output bits sequentially.

What are the typical supply voltage options?

The supply voltage range is 3.3 to 5.0 V, with 3.3 V for low-power applications and 5 V for legacy TTL compatibility. Confirm the exact requirement for your design.

How does the operating temperature range affect usage?

The standard operating temperature range is -40 to 85 °C, suitable for industrial environments. Extended ranges may be available on request; verify with the supplier.

What standards are referenced for ESD and temperature?

ESD tolerance is tested per IEC 61000-4-2 (HBM model) with ±2000 V, and temperature testing references IEC 60068-2-1/2. These are verification references, not certifications.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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