Editorial Technical Reference

Photodetector Module

This page explains how Photodetector Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A modular electronic component that converts incident light into an electrical signal.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Photodetector Module

Definition
A photodetector module is a self-contained electronic assembly designed as part of a sensor array, such as those used in laser displacement systems. Its primary function is to detect and measure light intensity, converting photons into a proportional electrical current or voltage signal for processing by the array's control unit. The module integrates a photodetector element (e.g., a photodiode or phototransistor) with signal conditioning circuitry, including amplification and filtering, within a protective housing. It is typically mounted on a ceramic or PCB substrate and may include an optical connector for fiber input. The module is specified for spectral response from 400 to 1700 nm, with responsivity at peak wavelength between 0.9 and 1.1 A/W. Rise time ranges from 0.5 to 5 ns, and bandwidth from 100 to 1000 MHz. Dark current is 0.1 to 10 nA at 5 V reverse bias. Supply voltage is 5 to 24 V DC, and the output is an analog voltage of 0 to 5 V. Operating temperature is -40 to 85 °C, with storage from -40 to 100 °C. Humidity range is 5 to 95% RH non-condensing. Ingress protection is rated IP54 to IP67 per IEC 60529. Connector types include SMA to FC. Dimensions range from 20 to 50 mm, and weight from 50 to 200 g without cable. These values are typical reference ranges; actual specifications must be confirmed with the manufacturer for the specific model. The module is used in applications requiring precise light detection, such as laser displacement sensing, and is selected based on spectral range, speed, and environmental requirements. Verification of performance and compliance with standards should be done through the manufacturer's datasheet and testing.
Working Principle
The module operates on the principle of the photoelectric effect. When photons strike the active area of the photodetector (e.g., a photodiode or phototransistor within the module), they generate electron-hole pairs, creating a measurable photocurrent. This analog signal is then conditioned (e.g., amplified, filtered) by integrated circuitry within the module before being output. The output is an analog voltage proportional to the incident light intensity, which can be processed by the control unit of the sensor array.
Common Materials
Semiconductor (e.g., Silicon, InGaAs), Ceramic/PCB substrate, Protective housing (plastic/metal)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Spectral Range400–1700 nmSi for visible, InGaAs for NIR
Responsivity0.9–1.1 A/WAt peak wavelength
Rise Time0.5–5 ns10%–90%
Bandwidth100–1000 MHz3 dB
Dark Current0.1–10 nAAt 5 V reverse bias
Supply Voltage5–24 V DCDepending on amplifier
Output Signal0–5 VAnalog
Operating Temperature-40–85 °CStorage -40–100
Humidity5–95 % RHNon-condensing
Ingress ProtectionIP54–IP67Depends on housingIEC 60529
Connector TypeSMA–FCOptical input
Dimensions20–50 mmDiameter or length
Weight50–200 gWithout cable

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Photodiode Chip Part
    The core light-sensitive semiconductor element that generates photocurrent.
    Material: Silicon or compound semiconductor (e.g., InGaAs)
  • Transimpedance Amplifier (TIA)
    Converts the small photocurrent from the photodiode into a proportional voltage signal.
    Material: Integrated circuit (silicon)
  • Optical Window/Filter Part
    Protects the sensitive chip and can filter specific wavelengths of light.
    Material: Glass or optical polymer

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 atm (standard atmospheric)
other spec: Wavelength range: 400-1100 nm, Response time: <10 ns
temperature: -40°C to +85°C
Media Compatibility
✓ Clear optical windows ✓ Fiber optic cables ✓ Laboratory air environments
Unsuitable: High-vibration industrial machinery environments
Sizing Data Required
  • Required wavelength sensitivity (nm)
  • Desired signal-to-noise ratio (dB)
  • Incident light power range (μW to mW)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Optical window contamination
Cause: Accumulation of dust, oil, or particulates on the optical surface, degrading light transmission due to environmental exposure or improper sealing.
Sensor degradation
Cause: Thermal stress or electrical overstress leading to reduced sensitivity, increased noise, or complete failure, often from improper cooling or voltage spikes.
Maintenance Indicators
  • Inconsistent or fluctuating output readings under stable light conditions
  • Visible condensation, haze, or debris accumulation on the optical window
Engineering Tips
  • Implement regular cleaning protocols using appropriate optical-grade solvents and lint-free wipes, and ensure proper sealing/gasketing to prevent contamination ingress.
  • Maintain stable operating temperatures with adequate cooling and use surge protection/regulated power supplies to prevent electrical overstress.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 60747-5-5 - Semiconductor devices - Discrete devices and integrated circuits - Part 5-5: Optoelectronic devices - Photocouplers CE Marking - Compliance with EU EMC Directive 2014/30/EU and Low Voltage Directive 2014/35/EU

Quoted from the published standard.

Manufacturing Precision
  • Wavelength Sensitivity: +/- 5 nm
  • Responsivity: +/- 10% at specified wavelength
Quality Inspection
  • Dark Current and Noise Measurement Test
  • Spectral Response Curve Verification

Manufacturers of Photodetector Module

Manufacturer profiles associated with Photodetector Module.

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Frequently Asked Questions

What is the spectral range of the photodetector module?

The spectral range is 400 to 1700 nm, covering visible to near-infrared wavelengths. Silicon is used for visible light, and InGaAs for NIR. Confirm the exact range for your model.

What is the output signal type?

The output is an analog voltage signal ranging from 0 to 5 V. This signal is proportional to the incident light intensity and can be read by the control unit.

What are the environmental limits?

Operating temperature is -40 to 85 °C, storage -40 to 100 °C, and humidity 5 to 95% RH non-condensing. Ingress protection is IP54 to IP67 per IEC 60529. Verify for your application.

How do I verify the module's specifications?

Always check the manufacturer's datasheet for the specific model. The values provided are typical reference ranges and must be confirmed for your intended use.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
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