Secure Memory Array

Product Specifications

Technical details and manufacturing context for Secure Memory Array

Definition

The Secure Memory Array is a specialized hardware component used within key storage systems to provide isolated, hardware-protected memory for cryptographic keys, certificates, and other sensitive security parameters. It is designed to withstand both physical and logical attacks, ensuring that stored data remains confidential and unaltered throughout its lifecycle. The component integrates multiple layers of protection, including hardware encryption, access control, tamper detection, and secure erase capabilities. Data written to the array is encrypted by dedicated cryptographic engines before storage, and access requests are authenticated via secure protocols. Any physical tampering triggers immediate data destruction, and logical isolation from other system components prevents software-based attacks. The array is manufactured using silicon semiconductor technology, with an encryption co-processor die and tamper-resistant packaging. It offers a storage capacity of 1–64 GB, data retention of 10–25 years at 25°C (per JESD22-A117), and endurance of 100,000–1,000,000 program/erase cycles per sector (per JESD47). It operates over an industrial temperature range of -40°C to 85°C (per IEC 60068-2-1 and IEC 60068-2-2), with a supply voltage of 3.3V ±5%. Active current is 50–150 mA, standby current is 1–10 µA, and tamper resistance is rated at levels 4–6 (per FIPS 140-2). Encryption is hardware-accelerated AES-256 (per FIPS 197). The interface is selectable via configuration pins, supporting SPI or I2C, with clock frequencies of 10–50 MHz (SPI mode; I2C up to 1 MHz). The component is available in QFN packages with body sizes of 5–10 mm (per JEDEC MS-026) and weighs 0.5–2.0 g depending on package type. These specifications are reference ranges; actual values must be confirmed with the manufacturer for specific models and applications. Standards listed are for verification purposes and do not imply certification or compliance of any particular product.

Working Principle

The secure memory array operates by implementing multiple layers of protection. Data is encrypted using dedicated cryptographic engines before storage. Access requests are authenticated through secure protocols. Physical tampering triggers immediate data destruction. The array maintains logical isolation from other system components to prevent software-based attacks. It includes tamper detection circuits and secure erase capabilities. The encryption co-processor handles AES-256 encryption. The interface supports SPI or I2C, selectable via configuration pins. The array is designed to operate within specified voltage, temperature, and current ranges. It provides secure storage for cryptographic keys and sensitive data, ensuring confidentiality and integrity.

Common Materials

Silicon semiconductor, Encryption co-processor die, Tamper-resistant packaging

Technical Parameters

Parameter	Typical range	Notes & selection driver
Storage Capacity	1–64 GB	Total secure memory available for key storage.
Data Retention	10–25 years	Guaranteed retention at 25°C.JESD22-A117
Endurance	100000–1000000 cycles	Minimum program/erase cycles per sector.JESD47
Operating Temperature	-40–85 °C	Industrial grade; extended range available.IEC 60068-2-1, IEC 60068-2-2
Supply Voltage	3.3 ±5% V	Single supply; internal voltage regulator.
Active Current	50–150 mA	During read/write operations.
Standby Current	1–10 µA	In sleep mode with tamper detection active.
Tamper Resistance	4–6 level	Physical and logical tamper response.FIPS 140-2
Encryption Algorithm	AES-256 bit	Hardware-accelerated.FIPS 197
Interface Type	SPI/I2C	Selectable via configuration pins.
Clock Frequency	10–50 MHz	SPI mode; I2C up to 1 MHz.
Package Size	5–10 mm	QFN package, body size.JEDEC MS-026
Weight	0.5–2.0 g	Depends on package type.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Encryption Engine
Performs real-time encryption and decryption of data stored in the memory array

Material: Silicon semiconductor with cryptographic accelerators
Tamper Detection Mesh
Detects physical intrusion attempts and triggers secure erase procedures

Material: Conductive polymer or metal mesh
Access Control Unit
Manages authentication and authorization for memory access requests

Material: Secure microcontroller silicon
Storage Array
The memory cells the keys actually live in — everything else on this list protects them.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Key Storage

View system integration details

Secure Memory Module

View system integration details

Manufacturers of Secure Memory Array

Manufacturer profiles associated with Secure Memory Array.

Sourcing Secure Memory Array from China?

Tell us your specification and target quantity — we will match it against manufacturer records and come back with the factories that fit.

Request manufacturers We manufacture this

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Frequently Asked Questions

What is the Secure Memory Array used for?

It is used in key storage systems to securely store cryptographic keys, certificates, and other sensitive data, protecting them from unauthorized access and tampering.

What security features does it have?

It includes hardware encryption (AES-256), access control, tamper detection circuits, secure erase, and logical isolation from other system components.

What are the interface options?

The interface is selectable via configuration pins, supporting SPI or I2C. SPI mode supports clock frequencies of 10–50 MHz, while I2C supports up to 1 MHz.

How should I verify specifications?

The listed values are reference ranges. You must confirm model-specific values and standards with the legal manufacturer or supplier before procurement.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Buyer enquiry

Request manufacturing insight for Secure Memory Array

Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.

Where it goes: Straight to the CNFX editorial desk, and to the manufacturer if this product is linked to a claimed profile. Nothing is broadcast to a supplier list.
Your details stay here: We do not sell or rent enquiry data, and we do not add you to a mailing list. Used only to answer this request.
No commission, no middleman: CNFX is a directory. We take no cut of any order and never negotiate on a supplier's behalf.
What we don't claim: A listing is not an endorsement. Qualify every supplier and verify every figure yourself before ordering.

pressure:	Atmospheric to 1.5 atm (sealed enclosure)
other spec:	Humidity: 0-95% non-condensing, Vibration: 5-2000 Hz at 10g, Shock: 1000g 0.5ms
temperature:	-40°C to +85°C (operational), -55°C to +125°C (storage)

Product Specifications

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards