Transceiver Module for Data Communication | Specifications & Verification

Product Specifications

Technical details and manufacturing context for Transceiver Module

Definition

A transceiver module is a critical sub-component within a Physical Interface Controller that handles the bidirectional conversion and transmission of electrical signals to optical signals (or vice versa) for data communication over various media such as fiber optic cables or copper wires. It serves as the interface between the controller's internal circuitry and the external communication link. The module is designed for use in computer, electronic, and optical product manufacturing, where it enables reliable data exchange in networking equipment, data centers, and telecommunications systems. Its compact form factor, typically 13.5 × 8.5 × 5.5 mm, allows for high-density PCB mounting, and its weight of 10–15 g ensures minimal mechanical stress. The module operates over a wide temperature range (-40 to 85 °C) and can be stored between -40 and 95 °C, with non-condensing humidity from 5% to 95% RH. It requires a supply voltage of 3.3 V DC ±5% and consumes between 0.5 and 1.5 W, depending on operating conditions. The transmitter output power ranges from -3 to 0 dBm, while the receiver sensitivity is between -20 and -14 dBm, ensuring compatibility with typical link budgets. The module supports data rates from 1 to 10 Gbps, with higher rates demanding better signal integrity. It uses an LC connector type per IEC 61754-20 and is designed for single-mode fiber (SMF) per ITU-T G.652, with wavelengths in the 1310–1550 nm range per ITU-T G.694.1. Materials include semiconductor substrates (silicon or GaAs), plastic housing, copper alloy for electrical contacts, and optical glass for lensing. These specifications are reference ranges; actual values must be verified with the manufacturer for specific models and applications. Standards listed are for procurement and verification, not certification of compliance.

Working Principle

The module operates by receiving electrical data signals from the Physical Interface Controller. Its transmitter section converts these electrical signals into optical signals (using a laser or LED) for transmission over fiber, or prepares them for transmission over copper. Simultaneously, its receiver section detects incoming optical signals (via a photodiode) or electrical signals from the link, converts them back into electrical signals, and passes them to the controller for processing. This bidirectional operation enables full-duplex communication, where data can be sent and received simultaneously. The module's internal circuitry manages signal conditioning, amplification, and timing to ensure reliable data transfer. The transmitter output power and receiver sensitivity are key parameters that determine the achievable link distance and performance. The module is designed to meet specific interface standards, such as the SFP form factor, and must be matched with compatible connectors and fiber types. Proper operation requires adherence to the specified supply voltage and environmental conditions. Signal integrity is critical at higher data rates, so the module's design minimizes crosstalk and electromagnetic interference. The module's performance can be affected by temperature extremes, humidity, and mechanical stress, so it must be handled and installed according to manufacturer guidelines.

Common Materials

Semiconductor (Silicon/GaAs), Plastic Housing, Copper Alloy, Optical Glass

Technical Parameters

Parameter	Typical range	Notes & selection driver
Data Rate	1–10 Gbps	Higher rates require better signal integrity
Supply Voltage	3.3 ±5% V DC	Outside range may cause malfunction
Operating Temperature	-40–85 °C	Exceeding limits may degrade performance
Storage Temperature	-40–95 °C	Long-term storage outside range may damage
Humidity	5–95 % RH	Non-condensing
Power Consumption	0.5–1.5 W	Lower is better for energy efficiency
Transmitter Output Power	-3–0 dBm	Must meet link budget
Receiver Sensitivity	-20–-14 dBm	More negative is better
Connector Type	LC	Compatible with standard patch cordsIEC 61754-20
Fiber Type	SMF	Single-mode fiberITU-T G.652
Wavelength	1310–1550 nm	Depends on versionITU-T G.694.1
Dimensions	13.5 × 8.5 × 5.5 mm	SFP form factor
Weight	10–15 g	Lightweight for PCB mounting

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Laser Diode (Transmitter) Part
Converts incoming electrical data signals into modulated optical signals for transmission.

Material: Gallium Arsenide (GaAs) or Indium Phosphide (InP)
Photodiode (Receiver) Part
Detects incoming optical signals and converts them back into electrical signals.

Material: Silicon or InGaAs
Driver IC
Amplifies and conditions the electrical signal to drive the laser diode accurately.

Material: Silicon
Limiting Amplifier / TIA
Amplifies the weak electrical signal from the photodiode to a usable level for the controller (Transimpedance Amplifier).

Material: Silicon

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Transceiver Module.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Physical Interface Controller

View system integration details

Manufacturers of Transceiver Module

12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

MORNSUN Guangzhou Science & Technology Co., Ltd.

Guangzhou, Guangdong, CN

IATF16949 EN60335-1 EN50155

Also makes: Computer Power Supply Unit (PSU) Voltage Regulator Module, Transformer

Stated by the company · profile compiled by CNFX from public sources

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Beijing Fiber Linker Communication Co.,Ltd

Beijing, CN