INDUSTRY COMPONENT

Collector Terminal

Collector terminal is the electrical connection point for the collector region in power semiconductor devices like IGBTs and SCRs, enabling current flow and heat dissipation.

Component Specifications

Definition
The collector terminal is a critical component in power semiconductor devices such as Insulated Gate Bipolar Transistors (IGBTs) and Silicon Controlled Rectifiers (SCRs). It serves as the electrical interface to the collector region, which is the primary current-carrying layer in these devices. The terminal is designed to handle high current densities (typically 100-600 A/cm²) and voltages (up to 6.5 kV for IGBTs), while facilitating efficient heat transfer to external cooling systems. It connects internally to the collector metallization layer and externally to the circuit via soldering, wire bonding, or press-fit connections. The design must ensure low electrical resistance (<1 mΩ), high thermal conductivity (>200 W/m·K), and mechanical stability under thermal cycling conditions.
Working Principle
The collector terminal operates by providing a low-resistance path for majority carriers (electrons in N-type, holes in P-type) to enter or exit the collector region. In IGBTs, it collects electrons from the emitter during conduction; in SCRs, it serves as the anode terminal for current flow. The terminal's material and geometry minimize voltage drop and Joule heating, while its thermal interface dissipates heat generated in the semiconductor junction to prevent thermal runaway.
Materials
Oxygen-free high-conductivity (OFHC) copper (C10100/C10200) with nickel or silver plating (2-5 μm thickness), aluminum alloy (6061-T6) for lightweight applications, or copper-molybdenum-copper (CMC) clad materials for thermal expansion matching. Plating specifications: MIL-DTL-45204 for electroplating, ASTM B488 for electroless nickel.
Technical Parameters
  • Current Rating 50-1200 A
  • Voltage Rating 600-6500 V
  • Mechanical Life >1000 cycles
  • Contact Resistance <0.5 mΩ
  • Insulation Voltage 2500 VAC (min)
  • Thermal Resistance <0.1 °C/W
  • Operating Temperature -55 to +175 °C
Standards
ISO 16750-4, DIN EN 60068-2-14, IEC 60747-9

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Collector Terminal.

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Thermal fatigue from cycling
  • Electromigration at high current density
  • Galvanic corrosion in humid environments
  • Mechanical stress from mounting
  • Creep in solder joints
FMEA Triads
Trigger: Thermal cycling exceeding material CTE mismatch
Failure: Crack formation in solder or bonding interface
Mitigation: Use CMC clad materials, implement strain-relief designs, and control soldering profile (peak temp 240-260°C)
Trigger: High current density (>300 A/cm²) with insufficient cooling
Failure: Localized overheating and metallization degradation
Mitigation: Increase terminal cross-section, use forced air/liquid cooling, and apply thermal interface materials with >3 W/m·K conductivity
Trigger: Vibration in mobile applications
Failure: Terminal loosening or fracture
Mitigation: Implement lock washers, thread-locking compounds, and press-fit designs with 0.05-0.10 mm interference fit

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.1 mm for critical dimensions, ±5% for electrical resistance, flatness within 0.05 mm over contact area
Test Method
IEC 60068-2-21 for vibration, MIL-STD-202 for shock, IPC-TM-650 for solderability, ASTM B539 for contact resistance

Buyer Feedback

★★★★☆ 4.9 / 5.0 (34 reviews)

"The technical documentation for this Collector Terminal is very thorough, especially regarding technical reliability."

"Reliable performance in harsh Electrical Equipment Manufacturing environments. No issues with the Collector Terminal so far."

"Testing the Collector Terminal now; the technical reliability results are within 1% of the laboratory datasheet."

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Frequently Asked Questions

What is the difference between collector and emitter terminals in IGBTs?

The collector terminal connects to the high-voltage side and handles majority carrier collection, while the emitter terminal connects to the low-voltage side and controls minority carrier injection. Collector terminals are typically larger for heat dissipation.

Can collector terminals be interchanged between IGBTs and SCRs?

Not directly. IGBT collector terminals are optimized for fast switching and bidirectional current, while SCR anode terminals are designed for unidirectional, high-surge current applications. Material and plating specifications differ.

How does terminal plating affect performance?

Silver plating reduces contact resistance and improves solderability but oxidizes; nickel plating provides corrosion resistance but increases resistance. Gold flash over nickel offers the best balance for high-reliability applications.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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