Editorial Technical Reference

Power Semiconductor Devices (IGBTs/SCRs)

This page explains how Power Semiconductor Devices (IGBTs/SCRs) is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

Power semiconductor components (IGBTs/SCRs) for high-voltage, high-current switching and control in industrial applications.

Product Specifications

Technical details and manufacturing context for Power Semiconductor Devices (IGBTs/SCRs)

Definition
Power semiconductor devices, specifically Insulated Gate Bipolar Transistors (IGBTs) and Silicon Controlled Rectifiers (SCRs), are key components within Power Semiconductor Assembly that enable efficient power conversion, switching, and control in high-voltage, high-current applications such as motor drives, power supplies, and industrial automation systems. These components are designed to handle voltages from 600 V to 6500 V and continuous currents from 10 A to 3600 A, with switching frequencies typically ranging from 1 kHz to 100 kHz for IGBTs. They are available in packages such as TO-247 to IHM-B, with weights ranging from 5 g to 500 g depending on package and current rating. Key electrical parameters include saturation voltage (V_CE(sat)) of 1.5–3.2 V at rated current and 25°C, gate threshold voltage (V_GE(th)) of 3–6 V, and isolation voltage of 2500–6000 V RMS between terminals and base plate. Thermal resistance (junction-to-case) ranges from 0.05 to 1.5 K/W, and power dissipation (P_tot) can reach 100–2000 W at 25°C case temperature. Operating temperature range is -40°C to 150°C, and short circuit withstand time is typically 10–20 µs for IGBTs. Materials used include silicon, copper, aluminum, ceramic substrates, and epoxy molding compounds. These devices are verified against IEC 60747-9 for parameters such as collector-emitter voltage, collector current, saturation voltage, gate threshold voltage, operating temperature range, thermal resistance, isolation voltage, power dissipation, short circuit withstand time, and package type. However, all values are directory reference ranges and must be confirmed for the specific model and application with the legal manufacturer or supplier. The standards listed are procurement references and do not imply certification or compliance of any particular product.
Working Principle
IGBTs combine the high-input impedance of MOSFETs with the low on-state voltage drop of bipolar transistors, allowing voltage-controlled switching of high currents. They are turned on by applying a voltage above the gate threshold (3–6 V) and can switch currents up to 3600 A with blocking voltages up to 6500 V. SCRs are thyristors that conduct current in one direction when triggered by a gate signal and remain conducting until the current drops below a holding threshold. Both device types are used in power conversion circuits where efficient control of high power is required. The switching frequency for IGBTs typically ranges from 1 to 100 kHz, while SCRs are typically used at lower frequencies due to their latching behavior. Thermal management is critical, as junction-to-case thermal resistance ranges from 0.05 to 1.5 K/W, and power dissipation can reach 2000 W. Proper gate drive and protection circuits are necessary to ensure reliable operation within the specified operating temperature range of -40°C to 150°C.
Common Materials
Silicon, Copper, Aluminum, Ceramic substrates, Epoxy molding compounds
Technical Parameters
ParameterTypical rangeNotes & selection driver
Collector-Emitter Voltage (V_CE)600–6500 VMaximum blocking voltage ratingIEC 60747-9
Collector Current (I_C)10–3600 AContinuous DC current ratingIEC 60747-9
Switching Frequency1–100 kHzTypical range for IGBTs
Saturation Voltage (V_CE(sat))1.5–3.2 VAt rated current and 25°CIEC 60747-9
Gate Threshold Voltage (V_GE(th))3–6 VMinimum gate voltage for turn-onIEC 60747-9
Operating Temperature Range-40–150 °CJunction temperature rangeIEC 60747-9
Thermal Resistance (Junction-to-Case)0.05–1.5 K/WLower is better for heat dissipationIEC 60747-9
Isolation Voltage2500–6000 V RMSBetween terminals and base plateIEC 60747-9
Power Dissipation (P_tot)100–2000 WMaximum allowable at 25°C case temperatureIEC 60747-9
Short Circuit Withstand Time10–20 µsTypical for IGBTsIEC 60747-9
Package TypeTO-247–IHM-BCommon packages for high powerIEC 60747-9
Weight5–500 gDepends on package and current rating

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Semiconductor Die Part
    Core switching element made of silicon that controls current flow
    Material: Silicon
  • Gate Terminal Part
    Control input that triggers the switching operation
    Material: Copper
  • Collector Terminal Part
    Main current input terminal for IGBTs
    Material: Copper
  • Emitter Terminal Part
    Main current output terminal for IGBTs
    Material: Copper
  • Anode Terminal Part
    Main current input terminal for SCRs
    Material: Copper
  • Cathode Terminal Part
    Main current output terminal for SCRs
    Material: Copper
  • Package Housing Part
    Protective enclosure that provides electrical insulation and thermal dissipation
    Material: Plastic/Epoxy
  • Heat Sink Interface Part
    Surface area designed for thermal management through heat sinks
    Material: Copper/Aluminum

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Power Semiconductor Devices (IGBTs/SCRs).

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Atmospheric to 1 atm (hermetic packages), vacuum compatible in sealed units
temperature: -40°C to +150°C (junction temperature), -55°C to +125°C (storage)
current rating: 10A to 3600A (module ratings)
voltage rating: 600V to 6500V (typical IGBT/SCR ranges)
switching frequency: Up to 50kHz (IGBTs), 1-10kHz (SCRs typical)
Media Compatibility
✓ Industrial motor drives (AC/DC) ✓ Power supplies (SMPS/UPS) ✓ Renewable energy inverters (solar/wind)
Unsuitable: High-radiation environments (nuclear/space) without radiation-hardened variants
Sizing Data Required
  • Maximum load current (A)
  • System DC bus voltage (V)
  • Required switching frequency (Hz)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal runaway
Cause: Excessive junction temperature due to inadequate cooling, overcurrent, or poor thermal interface, leading to uncontrolled temperature increase and device destruction.
Gate oxide breakdown
Cause: Overvoltage spikes on gate terminals, electrostatic discharge (ESD), or prolonged operation near voltage limits, causing insulation failure and short circuits.
Maintenance Indicators
  • Audible arcing or popping sounds during operation indicating insulation breakdown
  • Visible discoloration, bulging, or charring on device casing or heatsink from overheating
Engineering Tips
  • Implement active thermal management with temperature monitoring and derating curves to keep junction temperatures below 125°C during operation
  • Use snubber circuits and voltage clamping devices to suppress voltage transients and protect gate structures from overvoltage events

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 60747-9: Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) IEC 60747-6: Semiconductor devices - Discrete devices - Part 6: Thyristors (including SCRs) JEDEC JESD22: Test methods for semiconductor devices

Quoted from the published standard.

Manufacturing Precision
  • Gate threshold voltage (V_GE(th)): +/-0.5V
  • Collector-emitter saturation voltage (V_CE(sat)): +/-5% of nominal value
Quality Inspection
  • Thermal cycling test (e.g., JESD22-A104)
  • High-temperature reverse bias (HTRB) test

Manufacturers of Power Semiconductor Devices (IGBTs/SCRs)

4 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Changzhou Keneng Electronics Co., Ltd.
Jiangsu, CN
Also makes: Pressure Switch, Terminal Block, Film Capacitor and 2 more
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Power switches”
View source page ↗ czkennon.com · checked 2026-09-11
Halo Microelectronics
Shanghai, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Power Switches”
View source page ↗ halomicro.com · checked 2026-09-05
SG Micro (Beijing) Co., Ltd.
Beijing, CN
Also makes: DC-DC Converter, Power Management, Power Module and 9 more
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Power Switches”
View source page ↗ sg-micro.com · checked 2026-09-07
SGMICRO (Beijing) Co., Ltd.
Beijing, CN
Also makes: DC-DC Converter, Power Management, Power Module and 3 more
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Power Switches”
View source page ↗ sgmicro.com · checked 2026-09-08

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

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Frequently Asked Questions

What are the typical voltage and current ratings for these devices?

According to the directory, these components have a maximum blocking voltage rating (collector-emitter voltage) of 600–6500 V and a continuous DC current rating (collector current) of 10–3600 A. These are reference ranges; the actual ratings depend on the specific model and must be confirmed with the manufacturer.

What is the operating temperature range?

The junction temperature range is -40°C to 150°C, as listed in the parameters. This indicates the allowable temperature for the semiconductor junction during operation. Always verify the thermal limits for your specific application.

What standards apply to these components?

The parameters are referenced to IEC 60747-9, which covers semiconductor devices for power applications. This standard is a procurement reference; it does not guarantee that a specific product is certified or compliant. Always check with the manufacturer for compliance details.

What materials are used in these devices?

The materials on file include silicon, copper, aluminum, ceramic substrates, and epoxy molding compounds. These materials are typical for power semiconductor packaging and thermal management. Specific material grades may vary by manufacturer and model.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
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