Chemical agent that initiates and accelerates the curing process of epoxy resins in electrical insulation applications.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Pot Life | 30 minutes to 4 hours at 25°C | |
| Cure Time | 2 to 24 hours at ambient temperature, or 1 to 4 hours at elevated temperatures (e.g., 80-150°C) | |
| Viscosity | 100 to 5000 mPa·s at 25°C | |
| Chemical Type | Amine-based or Anhydride-based | |
| Volume Resistivity | >1e12 ohm-cm | |
| Dielectric Strength | 15 to 25 kV/mm | |
| Thermal Conductivity | 0.2 to 1.5 W/m·K | |
| Mix Ratio (Resin:Hardener) | 100:10 to 100:50 by weight | |
| Operating Temperature Range | -40°C to 180°C | |
| Glass Transition Temperature (Tg) | 80°C to 180°C |
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This component is used in the following industrial products
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Amine-based agents cure at lower temperatures (ambient to 80°C) and offer good mechanical strength, while anhydride-based agents require higher temperatures (100-150°C) but provide superior thermal stability, lower exotherm, and better electrical properties like reduced dielectric loss, making them ideal for high-voltage applications.
Pot life determines the working time after mixing resin and hardener. Short pot lives (e.g., 30 minutes) require rapid processing to avoid premature gelation, which can trap air bubbles and reduce dielectric strength. Long pot lives allow for complex potting or impregnation but may slow production. It must be balanced with cure time for optimal insulation quality.
Key tests include dielectric strength per IEC 60243, volume resistivity per IEC 60093, thermal cycling resistance, flame retardancy (UL 94), and ionic contamination testing to ensure low chloride and sodium levels, which prevent corrosion and electrical leakage in insulated components.
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