Package/case: Voltage Rating 600V to 1600V

Component Specifications

Definition

A specialized enclosure designed specifically for thyristor and triac semiconductor devices, serving as the primary protective structure that isolates the semiconductor die from environmental factors while facilitating electrical connections, heat dissipation, and mechanical mounting. The package/case ensures proper electrical insulation between the semiconductor and external circuits, manages thermal energy generated during operation through heat sinks or thermal interfaces, and provides structural integrity for handling and installation in various industrial applications.

Working Principle

The package/case functions as a multi-layer protective system: the inner cavity houses the semiconductor die with bonding wires connecting to external leads; insulating materials prevent electrical leakage; thermal conductive materials transfer heat from the die to external heat sinks; and the external structure provides mechanical mounting points and environmental sealing. During operation, it maintains electrical isolation between high-voltage terminals while efficiently conducting heat away from the semiconductor junction to prevent thermal runaway.

Materials

Typically composed of: ceramic (alumina or aluminum nitride) for high-voltage insulation and thermal conductivity, copper or copper alloys for lead frames and thermal bases, silicone gel or epoxy for internal encapsulation, and plastic (PPS, PBT, or epoxy molding compound) for external housing. High-power versions may include direct copper bonding (DCB) substrates and silver-filled die attach materials.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Package Type	TO-220, TO-247, TO-3P, SOT-223, D2PAK
Lead Material	Copper alloy with tin plating
Mounting Type	Through-hole or surface mount
Current Rating	10A to 100A
Voltage Rating	600V to 1600V
Isolation Voltage	2500V to 4000V
Thermal Resistance	0.5 to 2.5 °C/W
Operating Temperature	-40°C to 150°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IEC 60747, JEDEC MS-012, UL 94

Parent Products

This component is used in the following industrial products

Thyristor/Triac

A semiconductor switching device used for controlling AC power in solid state relays.

View Product Details

Engineering Analysis

Risks & Mitigation

Thermal overstress leading to device failure
Electrical insulation breakdown
Mechanical cracking under thermal cycling
Corrosion of external leads
Improper mounting causing thermal interface issues

FMEA Triads

Trigger: Insufficient thermal interface material
Failure: Overheating and thermal runaway
Mitigation: Use proper thermal grease/pads and ensure adequate mounting pressure

Trigger: Mechanical stress during installation
Failure: Cracked package or broken leads
Mitigation: Follow torque specifications and avoid bending leads after formation

Trigger: Environmental contamination
Failure: Corrosion and electrical leakage
Mitigation: Use conformal coating in harsh environments and proper sealing

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Lead position tolerance ±0.2mm, package dimensions ±0.1mm

Test Method

Visual inspection per IPC-A-610, thermal cycling test per JESD22-A104, high-potential test per IEC 60112

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

Compare the published product scope and source details, then include your specifications and quantity in an enquiry.

Manufacturers of Package/case

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

NICETY Machinery

Shandong, CN

Also makes: Vibrating Screen, Screw Conveyor, Loading Hopper and 6 more

Listed on the company's own website · profile compiled by CNFX from public sources

Listed there as: “Automatic Weighing package Case”
View source page ↗ nicetymachine.com · recorded 2026-08-27

View profile Send enquiry

Explore company information and manufacturing capabilities, then discuss the scope of your project with a relevant supplier.

Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

Related Components

Terminal Base

A terminal base is an insulating support structure that holds and organizes electrical terminals in motor terminal blocks, providing secure connections and circuit management.

Contact Plate

A conductive plate in motor terminal blocks that establishes electrical contact between conductors.

Marking Strip

A durable marking strip used for terminal identification in motor terminal blocks to ensure proper electrical connections and safety compliance.

Gland Body

A gland body is the main housing component of an aluminum cable gland that provides mechanical protection and environmental sealing for electrical cables entering enclosures.

Frequently Asked Questions

What is the difference between thyristor and triac packages?

Thyristor packages typically have three terminals (anode, cathode, gate) while triac packages have three terminals (MT1, MT2, gate) but both use similar package styles. The main difference is in internal construction and terminal arrangement rather than external package design.

Can different package types be interchangeable?

No, package types are not directly interchangeable due to differences in pin configuration, mounting requirements, and thermal characteristics. However, devices with the same package type (e.g., TO-220) from different manufacturers are generally interchangeable if electrical specifications match.

How important is thermal resistance in package selection?

Critical. Lower thermal resistance allows better heat dissipation, enabling higher current ratings and improved reliability. Proper heat sinking must be considered based on the package's thermal characteristics.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Package/case