Power semiconductor device package providing electrical connection, thermal management, and environmental protection for semiconductor chips.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Package Types | TO-220, TO-247, D2PAK, SOT-223, Module (e.g., IGBT modules) | |
| Current Rating | Up to 3600A | |
| Voltage Rating | Up to 6500V | |
| Isolation Voltage | 2500V AC min | |
| Thermal Resistance | 0.1-1.0°C/W | |
| Operating Temperature | -55°C to 175°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
Electronic components designed to control and convert electrical power in high-power applications.
An integrated circuit that amplifies and conditions signals for transmission and reception in electronic systems.
An integrated circuit or microcontroller that converts encoded digital signals into usable control signals within a decoder circuit.
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It provides electrical interconnection, heat dissipation, mechanical support, and environmental protection for the semiconductor die.
Through materials like copper baseplates and thermal interface materials that conduct heat away from the die to a heat sink, minimizing thermal resistance.
Key standards include IEC 60747 for semiconductor devices, ISO 16750 for environmental testing, and JEDEC standards for reliability.
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