A thermal interface baseplate is a critical component in power semiconductor modules that facilitates efficient heat transfer from semiconductor devices to cooling systems.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thickness | 1-5 mm | |
| Surface Flatness | <25 µm | |
| Dielectric Strength | >2.5 kV | |
| Thermal Conductivity | 150-400 W/m·K | |
| Operating Temperature Range | -40°C to +150°C | |
| Coefficient Of Thermal Expansion (CTE) | 4-24 ppm/°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Thermal Interface Baseplate.
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Its primary function is to efficiently transfer heat from semiconductor devices to cooling systems while providing electrical isolation and mechanical stability.
Materials like copper offer higher thermal conductivity but are heavier and more expensive; ceramics provide excellent electrical insulation; aluminum balances cost and performance with good thermal properties.
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