Silicon carbide switching · On-resistance instead of saturation voltage, gate voltage window, switching energy, isolation and baseplate
A silicon carbide (SiC) MOSFET power module packages SiC MOSFET dies — with or without separate SiC Schottky diodes — on an insulated substrate and baseplate in a half-bridge, full-bridge, six-pack or other configuration, for inverters, chargers and power supplies that switch faster or run hotter than silicon designs allow. Ask three things first: the blocking voltage and the on-resistance at your hottest junction temperature, the gate-voltage window and gate charge the driver must provide, and the switching energy, isolation and mechanical data for your converter.
Power modules built from silicon carbide MOSFETs, including SiC-MOSFET-only modules and modules with SiC Schottky diodes, in half-bridge, full-bridge, six-pack and single-switch configurations. Silicon IGBT modules (half-bridge, chopper, six-pack and PIM) are covered on the IGBT module page; discrete SiC MOSFETs, gate drivers, thyristor and diode modules and complete inverters are outside this page.
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01
Wolfspeed's CAB760M12HM3 is a 1200 V, 62 mm-footprint half-bridge listed at 760 A with an RDS(on) of 1.33 mΩ at 25 °C. Its datasheet gives 1.33 mΩ typical and 1.73 mΩ maximum at 25 °C and 2.34 mΩ at a 175 °C virtual junction temperature (VGS = 15 V, ID = 760 A), a DC drain current of 1015 A at a 25 °C case and 765 A at 90 °C, a body-diode current of 515 A, a junction temperature range of −40 to 175 °C, and a junction-to-case thermal resistance of 0.068 °C/W typical (0.073 maximum). [1] [2]
Editorial calculation: at 760 A the conduction loss per switch is I² × RDS(on) = 760² × 0.00133 Ω ≈ 768 W at 25 °C but 760² × 0.00234 Ω ≈ 1,352 W at 175 °C, about 1.76 times higher; with 0.068 °C/W junction-to-case, 1,352 W would raise the junction about 92 °C above the case, so design the thermal path with the hot on-resistance. [1]
Wolfspeed's module range spans blocking voltages of 650, 1200, 1700, 2300 and 3300 V in half-bridge, full-bridge, six-pack, single-switch, T-type and common-source configurations, from industry-standard 34 mm, 48 mm and 62 mm housings to 140 mm medium-voltage and 152 mm six-pack modules. [3] ROHM's BSM180D12P2C101 is a 1200 V, 204 A half bridge with 1360 W total power dissipation in a 122.0 × 45.6 mm package 17.5 mm thick, described as a SiC-MOSFET-only module with low body-diode Qrr and trr; ROHM marks it not recommended for new designs, so check lifecycle status before qualifying any module. [4]
Give the supplier the converter topology and configuration (half bridge, six-pack, other), DC-link voltage, RMS and peak current, switching frequency, maximum junction temperature you will allow, cooling method and heatsink, gate-driver voltage levels, isolation and creepage requirements, package footprint, qualification grade (industrial or automotive) and expected production life.
02
The CAB760M12HM3 datasheet gives a maximum transient gate-source voltage of −8/+19 V and a recommended static operating level of −4/+15 V, with the turn-on gate voltage held at 15 V ±5%. Gate threshold is 1.8–3.6 V (2.5 V typical) at 25 °C and 2.0 V at 175 °C; total gate charge is 2724 nC and internal gate resistance 0.47 Ω. [1]
Measured at 600 V and 760 A with −4/+15 V drive and 1.0 Ω external gate resistors, turn-on energy is 20.3 mJ at 25 °C and 23.7 mJ at 175 °C, and turn-off energy 17.9 mJ at 25 °C and 17.8 mJ at 175 °C. [1] Editorial calculation: at 175 °C one switching cycle costs 23.7 + 17.8 = 41.5 mJ, so at 20 kHz and the same voltage and current the switching loss per switch would be 41.5 mJ × 20,000 ≈ 830 W; scale for your own current and voltage and confirm with the supplier's loss curves. [1]
Editorial calculation: driving 2724 nC between −4 V and +15 V at 20 kHz takes about 2724 nC × 19 V × 20,000 ≈ 1.04 W of gate-drive power per switch, a figure to pass to the gate-driver designer. [1]
03
Wolfspeed lists a case isolation voltage of 4 kV AC (50 Hz, 1 minute), a comparative tracking index of 600, terminal-to-baseplate clearance of 12.70 mm and creepage of 15.30 mm, stray inductance of 4.9 nH between terminals 1 and 3, a weight of 179 g, a lightweight AlSiC baseplate mounted with M6 bolts and power terminals on M4 bolts, and a 110 × 65 × 12.2 mm module size for the CAB760M12HM3. [1] [2]
Editorial note: the IGBT-module habit of reading collector-emitter saturation voltage does not carry over — a SiC MOSFET's conduction drop is current × RDS(on), so the field below is filled from on-resistance, and the body-diode or Schottky-diode data replace a separate freewheeling-diode rating.
04
Each row names the condition the value was measured at; compare modules only at matching voltage, current and temperature.
| Field | Published values and meaning | Ask the supplier for |
|---|---|---|
| Rated voltage (V) | CAB760M12HM3 and BSM180D12P2C101: 1200 V; family to 3300 V. [1] [4] [3] | Blocking voltage and derating. |
| Rated current (A) | CAB760: 760 A listed, 765 A DC at 90 °C case; BSM180: 204 A. [2] [1] [4] | Current at your case temperature. |
| Switching frequency (kHz) | Set by loss budget; CAB760 Eon/Eoff 23.7/17.8 mJ at 175 °C. [1] | Loss curves versus current. |
| Collector-emitter saturation voltage (V) | Not used for SiC MOSFETs; read RDS(on): 1.33 mΩ at 25 °C, 2.34 mΩ at 175 °C. [1] | RDS(on) at your junction temperature. |
| Thermal resistance (junction-to-case) (K/W) | CAB760: 0.068 typ, 0.073 max °C/W. [1] | Value and TIM assumption. |
| Operating junction temperature (°C) | CAB760: −40 to 175 °C. [1] | Continuous and transient limits. |
| Isolation voltage (V AC) | CAB760: 4 kV AC, 50 Hz, 1 min. [1] | Test voltage and duration. |
| Creepage distance (mm) | CAB760: 15.30 mm terminal to baseplate. [1] | Terminal-to-terminal and to baseplate. |
| Clearance distance (mm) | CAB760: 12.70 mm terminal to baseplate. [1] | Values for your pollution degree. |
| Dimensions (L×W×H) (mm) | CAB760: 110 × 65 × 12.2; BSM180: 122.0 × 45.6 × 17.5. [2] [4] | Footprint and terminal layout. |
| Weight (g) | CAB760: 179 g. [1] | Weight. |
| Ingress protection | Not rated for a module mounted inside a converter. | Encapsulation and humidity tests. |
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Paste it into your enquiry below or into an email to a maker, then replace every bracket.
Converter: [topology; configuration; DC-link voltage] Current: [RMS; peak; switching frequency] Thermal: [max junction temperature; cooling; heatsink] Gate drive: [voltage levels; driver current] Insulation: [isolation voltage; creepage; clearance] Package and life: [footprint; qualification grade; lifecycle status]
Greegoo lists 1200 V and 1700 V SiC MOSFET modules next to its IGBT, FRED and thyristor-diode modules.
Lists SiC MOSFET modules at 1200 V and 1700 V and SiC Schottky diodes, alongside IGBT, FRED, power MOSFET and thyristor-diode modules.
Product scope checked 2026-10-12
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Wolfspeed's CAB760M12HM3 rises from 1.33 mΩ at 25 °C to 2.34 mΩ at 175 °C, so conduction loss at 760 A grows about 1.76 times. [1]
Wolfspeed recommends −4/+15 V static for the CAB760M12HM3, with −8/+19 V as the transient maximum. [1]
Some are SiC-MOSFET-only and rely on the body diode; ROHM describes the BSM180D12P2C101 that way, with low body-diode Qrr and trr. [4]
Sources checked 2026-10-12. Wolfspeed and ROHM are SiC device makers describing their own power modules: Wolfspeed's module family page, its CAB760M12HM3 product page and datasheet, and ROHM's BSM180D12P2C101 product page.
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