INDUSTRY COMPONENT

Chip Tray Recess

A precision recess in machine bases designed to securely hold and align chip trays during semiconductor manufacturing processes.

View Specifications

Component Specifications

Definition
The Chip Tray Recess is a machined cavity or depression integrated into the structural base of semiconductor manufacturing equipment, engineered to provide exact positioning, vibration damping, and thermal stability for chip trays that carry wafers through various processing stages. This component ensures precise alignment with robotic handlers and maintains consistent tray orientation during high-speed operations.
Working Principle
Works by providing a geometrically constrained interface that locates the chip tray through mechanical registration features (such as pins, edges, or grooves), often incorporating damping materials or thermal management elements to absorb vibrations and control temperature fluctuations during semiconductor fabrication processes.
Materials
Typically manufactured from high-grade aluminum alloys (e.g., 6061-T6 or 7075) for lightweight rigidity, or stainless steel (e.g., 304 or 316) for enhanced corrosion resistance. May include embedded elastomeric damping inserts or ceramic thermal pads.
Technical Parameters
  • Depth 5-20 mm
  • Flatness ≤ 0.1 mm/m²
  • Tolerance ±0.05 mm
  • Load Capacity 10-50 kg
  • Surface Finish Ra ≤ 0.8 μm
  • Thermal Stability ≤ 0.01 mm/°C
Standards
ISO 9001, ISO 14644, SEMI S2, DIN 876

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Chip Tray Recess.

chip tray recess semiconductor base component wafer tray alignment machine base precision vibration damping recess thermal management cavity Chip Tray Recess in Machinery and Equipment Manufacturing

Parent Products

This component is used in the following industrial products

Base

The foundational structural component of a surface grinder that provides stability and support for the entire machine.

View Product Details

Engineering Analysis

Risks & Mitigation
  • Misalignment causing wafer damage
  • Thermal expansion affecting precision
  • Material fatigue from repeated loading
  • Contamination accumulation in recess
FMEA Triads
Trigger: Wear on registration surfaces
Failure: Gradual loss of positioning accuracy
Mitigation: Regular calibration and use of wear-resistant coatings
Trigger: Thermal cycling stress
Failure: Dimensional instability and cracking
Mitigation: Material selection with matched thermal expansion coefficients
Trigger: Contaminant buildup
Failure: Interference with tray seating
Mitigation: Design with drainage features and scheduled cleaning protocols

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Maintains positioning accuracy within ±0.05 mm under operational conditions
Test Method
Coordinate measuring machine (CMM) verification, laser alignment testing, thermal cycling validation

Buyer Feedback

★★★★☆ 4.9 / 5.0 (28 reviews)

"As a professional in the Machinery and Equipment Manufacturing sector, I confirm this Chip Tray Recess meets all ISO standards."

"Standard OEM quality for Machinery and Equipment Manufacturing applications. The Chip Tray Recess arrived with full certification."

"Great transparency on the Chip Tray Recess components. Essential for our Machinery and Equipment Manufacturing supply chain."

Related Components

Inspection Frame
Structural support component in automated fabric inspection systems that holds cameras, sensors, and lighting for defect detection.
Machine Frame
The rigid structural foundation of a CNC wood router that provides stability, vibration damping, and precision alignment for cutting operations.
pH Sensor Assembly
Precision pH sensor assembly for automated monitoring and dosing systems in industrial applications
Load Cell Assembly
Precision load cell assembly for automated powder dispensing systems

Frequently Asked Questions

What is the primary function of a Chip Tray Recess?

To provide precise mechanical registration and stability for chip trays in semiconductor equipment, ensuring accurate positioning during automated handling and processing operations.

Why are tolerance specifications critical for this component?

Tight tolerances (typically ±0.05 mm) prevent misalignment that could cause wafer damage, processing errors, or robotic handling failures in high-precision semiconductor manufacturing.

How does the Chip Tray Recess contribute to vibration control?

Through integrated damping materials and optimized geometry that absorb mechanical vibrations from adjacent equipment, preventing resonance that could affect wafer positioning accuracy.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Get Quote for Chip Tray Recess

Chip guard mounting points Chip Tray/Guard Mounting Points