Chip Tray Recess: Load Capacity 10-50 kg, Depth 5-20 mm

Component Specifications

Definition

The Chip Tray Recess is a machined cavity or depression integrated into the structural base of semiconductor manufacturing equipment, engineered to provide exact positioning, vibration damping, and thermal stability for chip trays that carry wafers through various processing stages. This component ensures precise alignment with robotic handlers and maintains consistent tray orientation during high-speed operations.

Working Principle

Works by providing a geometrically constrained interface that locates the chip tray through mechanical registration features (such as pins, edges, or grooves), often incorporating damping materials or thermal management elements to absorb vibrations and control temperature fluctuations during semiconductor fabrication processes.

Materials

Typically manufactured from high-grade aluminum alloys (e.g., 6061-T6 or 7075) for lightweight rigidity, or stainless steel (e.g., 304 or 316) for enhanced corrosion resistance. May include embedded elastomeric damping inserts or ceramic thermal pads.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Depth	5-20 mm
Flatness	≤ 0.1 mm/m²
Tolerance	±0.05 mm
Load Capacity	10-50 kg
Surface Finish	Ra ≤ 0.8 μm
Thermal Stability	≤ 0.01 mm/°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 9001, ISO 14644, SEMI S2, DIN 876

Engineering Analysis

Risks & Mitigation

Misalignment causing wafer damage
Thermal expansion affecting precision
Material fatigue from repeated loading
Contamination accumulation in recess

FMEA Triads

Trigger: Wear on registration surfaces
Failure: Gradual loss of positioning accuracy
Mitigation: Regular calibration and use of wear-resistant coatings

Trigger: Thermal cycling stress
Failure: Dimensional instability and cracking
Mitigation: Material selection with matched thermal expansion coefficients

Trigger: Contaminant buildup
Failure: Interference with tray seating
Mitigation: Design with drainage features and scheduled cleaning protocols

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Maintains positioning accuracy within ±0.05 mm under operational conditions

Test Method

Coordinate measuring machine (CMM) verification, laser alignment testing, thermal cycling validation

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Chip Tray Recess

Manufacturer profiles associated with Chip Tray Recess.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the primary function of a Chip Tray Recess?

To provide precise mechanical registration and stability for chip trays in semiconductor equipment, ensuring accurate positioning during automated handling and processing operations.

Why are tolerance specifications critical for this component?

Tight tolerances (typically ±0.05 mm) prevent misalignment that could cause wafer damage, processing errors, or robotic handling failures in high-precision semiconductor manufacturing.

How does the Chip Tray Recess contribute to vibration control?

Through integrated damping materials and optimized geometry that absorb mechanical vibrations from adjacent equipment, preventing resonance that could affect wafer positioning accuracy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Chip Tray Recess