A heat sink structure dissipates heat from electronic or mechanical components to maintain optimal operating temperatures.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Fin Pitch | 2-10 mm | |
| Base Thickness | 3-10 mm | |
| Overall Dimensions | Custom | |
| Thermal Resistance | 0.1-5.0 °C/W | |
| Max Operating Temperature | 200 °C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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Manufacturer profiles associated with Heat Sink Structure.
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Fins increase the surface area available for heat transfer to the surrounding air, improving convective cooling efficiency.
Aluminum is lighter and cheaper with good thermal conductivity; copper offers higher conductivity but is heavier and more expensive. Choose based on weight, cost, and thermal requirements.
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