A heat sink structure dissipates heat from electronic or mechanical components to maintain optimal operating temperatures.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Fin Pitch | 2-10 mm | |
| Base Thickness | 3-10 mm | |
| Overall Dimensions | Custom | |
| Thermal Resistance | 0.1-5.0 °C/W | |
| Max Operating Temperature | 200 °C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Heat Sink Structure.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
Fins increase the surface area available for heat transfer to the surrounding air, improving convective cooling efficiency.
Aluminum is lighter and cheaper with good thermal conductivity; copper offers higher conductivity but is heavier and more expensive. Choose based on weight, cost, and thermal requirements.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.