Editorial Technical Reference

State Processor

This page explains how State Processor is classified within Machinery and Equipment Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A computational component within a State Tracker system that processes and analyzes state data from industrial equipment.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for State Processor

Definition
The State Processor is a specialized electronic component within the State Tracker system responsible for receiving, processing, and analyzing real-time state data from industrial machinery and equipment. It performs calculations, applies algorithms, and generates processed state information that can be used for monitoring, control, and decision-making purposes within manufacturing environments. The component is designed to handle data from various sensors and operational parameters, converting raw inputs into actionable insights. It operates within specified electrical and environmental limits, including a rated voltage of 24 V DC ±10% (per IEC 61131-2), power consumption between 5 and 15 W, and an operating temperature range of -40 to 85 °C (per IEC 60068-2-1/2). Storage temperature ranges from -40 to 105 °C, and humidity must be kept between 5% and 95% RH (non-condensing, per IEC 60068-2-78). The component offers ingress protection ratings from IP54 to IP65 (per IEC 60529), making it suitable for dusty or wet environments. Processing speed ranges from 100 to 500 MIPS, memory capacity from 256 to 1024 MB, and it supports 1 to 4 communication interface ports (per IEC 61158). Physical dimensions are 100 x 75 x 30 mm (W x H x D), with a weight between 0.5 and 1.5 kg. The mean time between failures (MTBF) is estimated at 50,000 to 100,000 hours (per IEC 61709). The State Processor is constructed from semiconductor materials, a printed circuit board, and electronic components. It is intended for integration into larger systems, and its performance must be verified against the specific model and application. Always confirm model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The State Processor receives raw sensor data and operational parameters from connected equipment. It applies signal processing algorithms and state analysis logic to interpret the data. The processor outputs processed state information, including operational status, performance metrics, and anomaly detection results. This information supports monitoring, control, and decision-making in manufacturing environments. The component operates within defined electrical and environmental limits, and its processing speed and memory capacity determine its real-time analysis capability. Communication interfaces enable data exchange with other system components. The processor's performance must be validated for the specific application, and adherence to relevant standards should be confirmed with the manufacturer.
Common Materials
Semiconductor materials, Printed circuit board, Electronic components
Technical Parameters
ParameterTypical rangeNotes & selection driver
Rated Voltage24 ±10% V DCOutside range may cause malfunctionIEC 61131-2
Power Consumption5–15 WHigher power may require cooling
Operating Temperature-40–85 °CExceeding range may cause failureIEC 60068-2-1/2
Storage Temperature-40–105 °CExceeding range may degrade componentsIEC 60068-2-1/2
Humidity5–95 % RHNon-condensingIEC 60068-2-78
Ingress ProtectionIP54–IP65Higher IP for dusty/wet environmentsIEC 60529
Processing Speed100–500 MIPSFaster for real-time analysis
Memory Capacity256–1024 MBLarger for data logging
Communication Interface1–4 portsNumber of portsIEC 61158
Dimensions (W x H x D)100 x 75 x 30 mmCompact for panel mounting
Weight0.5–1.5 kgLighter for portable applications
MTBF50000–100000 hHigher for reliabilityIEC 61709

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Microprocessor Unit
    Executes state processing algorithms and calculations
    Material: Semiconductor
  • Memory Module
    Stores temporary state data and processing results
    Material: Semiconductor
  • Input Interface
    Receives raw state data from connected equipment
    Material: Copper alloy
  • Output Interface
    Transmits processed state information to other system components
    Material: Copper alloy

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for State Processor.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 10 bar
flow rate: 0.1 to 100 L/min
temperature: -20°C to +85°C
Media Compatibility
✓ Water-based coolants ✓ Hydraulic oils (ISO VG 32-68) ✓ Process gases (air, nitrogen, inert gases)
Unsuitable: Highly corrosive acids (e.g., hydrochloric acid, sulfuric acid) or abrasive slurries with >30% solids
Sizing Data Required
  • Maximum expected data throughput (states/sec)
  • Required processing latency (ms)
  • Number of concurrent equipment states to track

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Bearing fatigue failure
Cause: Inadequate lubrication, contamination ingress, or excessive vibration leading to spalling, brinelling, or overheating in rotating components
Seal degradation and leakage
Cause: Chemical attack from process fluids, thermal cycling, mechanical wear, or improper installation compromising containment integrity
Maintenance Indicators
  • Abnormal high-frequency vibration or audible grinding noises from rotating assemblies
  • Visible fluid leakage around seals or unexpected pressure/temperature deviations in process parameters
Engineering Tips
  • Implement precision alignment and balancing during installation/overhaul, coupled with condition-based lubrication using filtered, compatible lubricants
  • Establish proactive thermal monitoring and seal integrity checks using infrared thermography and ultrasonic leak detection during routine inspections

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI/ISA-88.00.01 - Batch Control CE Marking - Machinery Directive 2006/42/EC

Quoted from the published standard.

Manufacturing Precision
  • Dimensional Accuracy: +/-0.05mm
  • Surface Finish: Ra 0.8μm
Quality Inspection
  • Functional Performance Test
  • Environmental Stress Screening (ESS)

Manufacturers of State Processor

Manufacturer profiles associated with State Processor.

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Manufacturing capability
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Inspection readiness
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Frequently Asked Questions

What is the primary function of the State Processor?

The State Processor receives raw sensor data and operational parameters from industrial equipment, applies signal processing and state analysis algorithms, and outputs processed state information such as operational status, performance metrics, and anomaly detection results.

What are the electrical requirements for the State Processor?

The rated voltage is 24 V DC ±10% per IEC 61131-2, and power consumption ranges from 5 to 15 W. Higher power may require additional cooling.

What environmental conditions can the State Processor withstand?

It operates in temperatures from -40 to 85 °C and can be stored from -40 to 105 °C. Humidity must be between 5% and 95% RH (non-condensing). Ingress protection is rated IP54 to IP65.

How should I verify the State Processor's specifications for my application?

Always confirm model-specific values and standards with the legal manufacturer or supplier. The listed ranges are reference values and must be validated for your specific use case.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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