Editorial Technical Reference

DDR3 and DDR3L memory module for industrial and embedded controllers: wide-temperature, ECC and ruggedised modules that keep long-lived control hardware running

DDR3 and DDR3L memory modules for industrial and embedded controllers · 1.5 V or 1.35 V, −40 to 85 °C wide-temperature grades, x72 ECC UDIMMs, 30 µin gold fingers, side fill and conformal coating

A memory module stores the program and data that a processor or signal processor works on. In factory controllers, embedded boards and vehicle computers designed around DDR3-generation chipsets, the module has to match that generation, and survive the temperature and vibration of the machine it sits in. The module in the picture is a full-length DIMM with nine DRAM packages on one side, a count consistent with a single-rank x72 ECC module (see the calculation below). This page covers DDR3 and DDR3L modules for that kind of equipment: voltage, temperature grade, ECC, form factors and the mechanical options suppliers list.

DDR3 (1.5 V) and DDR3L (1.35 V) memory modules for industrial PCs, embedded boards, controllers and in-vehicle computers: wide-temperature and commercial-temperature UDIMMs, SODIMMs, ECC UDIMMs and SODIMMs, very-low-profile modules and screw-retained rugged modules. DDR5 DIMMs, with DDR4 compared, are covered on the High-speed memory module (DDR5 DIMM) page; DDR4 modules bought as matched sets for a board on the DDR4 memory modules as a matched set page. The computers that take these modules are covered on the Industrial computer and Control computer for real-time machine control (soft-PLC industrial PC) pages. Flash storage, soldered-down memory and memory controllers are outside this page.

CNFX editorial research · Sources checked October 13, 2026 · 6 sources

Full-length memory module with nine black DRAM packages in a row and a gold edge connector with one key notch, held in an aluminium test fixture, with a multi-probe test head over another board behind it
Nine-chip DIMM held in a fixture under a probe head

01

1.5 V DDR3 or 1.35 V DDR3L, and a −40 to 85 °C grade: what the chips and modules are rated for

The voltage and temperature limits start at the DRAM chip. Micron's 2Gb DDR3L datasheet describes DDR3L as a low-voltage version of 1.5 V DDR3 that can also run in a 1.5 V compatible mode. [1]

Innodisk places its wide-temperature DDR3 SODIMM in in-vehicle, automation and embedded markets, in 2, 4 and 8 GB, with DDR3 and DDR3L part numbers side by side and a 1.18 in PCB height. [2] Transcend's industrial SO-DIMM uses DDR3 chips in FBGA packages on a 204-pin board with a 2,048-bit serial EEPROM for presence detect. [6]

Micron states that if case temperature exceeds 85 °C the DRAM must be refreshed at 2x, a 3.9 µs interval, with self refresh temperature (SRT) or auto self refresh (ASR) enabled, so the memory controller and its firmware have to support the extended range as well as the module. [1] Editorial calculation: 64 ms divided by 8,192 refresh commands is 7.8 µs between commands; at 32 ms it is 3.9 µs, matching Micron's 2x figure.

RatingDRAM chip (Micron 2Gb DDR3L)Module (Innodisk and Transcend industrial lines)
Supply voltageVDD = VDDQ = 1.35 V (1.283–1.45 V); backward compatible to 1.5 V ± 0.075 V [1]1.5 V (1.425–1.575 V) and 1.35 V (1.28–1.45 V) [2]; Transcend industrial SO-DIMM 1.5 V ± 0.075 V [6]
TemperatureCase temperature 0 to 95 °C commercial, −40 to 95 °C industrial [1]Operating −40 to 85 °C [2] [6]
Refresh64 ms, 8,192-cycle refresh up to 85 °C; 32 ms from above 85 °C to 95 °C [1]—
Data rateDDR3-1066 CL7 to DDR3-1866 CL13 speed grades [1]1066, 1333, 1600 and 1866 MT/s [2]; 1333 Mb/s per pin at CL 5–9 on Transcend's sheet [6]
Gold finger—30 µin [2] [6]

Ask for the module's operating temperature (ambient) and the DRAM chips' case-temperature grade, the supported voltages, and confirmation that the board's memory controller supports DDR3L at 1.35 V.

02

x72 ECC on a 240-pin UDIMM: one extra chip per rank to correct single-bit errors

Innodisk's wide-temperature DDR3 ECC UDIMM is a 240-pin, x72 module rated −40 to 85 °C, in 4 GB and 8 GB at 1066–1866 MT/s. Its order list builds both from 512M × 8 chips: the 4 GB module in one rank, the 8 GB in two. Innodisk says the ECC function detects and corrects single-bit errors during storage and transmission without asking the data source to resend. [3]

Editorial calculation: a 512M × 8 chip holds 4 Gb. Eight of them make a 64-bit rank of 32 Gb, or 4 GB; the x72 bus adds 8 check bits, one more x8 chip, so a single-rank 4 GB ECC UDIMM carries nine DRAM packages and a two-rank 8 GB module eighteen. The check bits add 8/64 = 12.5 % to the DRAM on the module.

Non-ECC SODIMMs in the same line are x64, 204-pin modules. [2] [6] For 1U systems Innodisk lists a very-low-profile ECC UDIMM for spaces lower than 1.18 in, rated 0 to 85 °C, tested to −40 to 110 °C thermal shock for 500 cycles and a 76 cm ISTA-1A package drop. [4]

Confirm that the board's chipset supports ECC UDIMMs (not only RDIMMs), and give the supplier the rank count and chip organisation the board was validated with.

03

Side fill, conformal coating and a 300-pin screw-retained module for vibration and contamination

Innodisk offers side fill, which reinforces the joints between chips and board for high vibration or mechanical stress, and conformal coating, an acrylic layer over the module PCB against moisture, dust and corrosive substances, as options on its wide-temperature DDR3 modules. [2] [3]

For applications where a socketed module could work loose, its DDR3 XR-DIMM uses a 300-pin connector and two mounting holes, in 8 GB at 1600 and 1866 MT/s, x64 non-ECC, 1.35 V or 1.5 V, with a 1.49 in PCB height and 0 to 85 °C operation. Innodisk notes that XR-DIMM features are customised per project. [5]

State the vibration and shock profile, the contamination (humidity, sulphur, dust) and whether the board takes a standard socket or a screw-retained connector.

04

What to send for an industrial DDR3 or DDR3L module

Paste it into your enquiry below or into an email to a maker, then replace every bracket.

Board: [make and model; chipset; validated module list]
Module: [UDIMM, SODIMM, ECC UDIMM, VLP or rugged connector; capacity; ranks; chip organisation]
Electrical: [1.5 V or 1.35 V; data rate; CAS latency]
Temperature: [operating range; chip case-temperature grade]
Protection: [side fill; conformal coating; gold finger thickness]
Supply: [lifecycle commitment; change notification; quantity]

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Buyer questions

Can a DDR3L module run at 1.5 V?

Micron's DDR3L chips are rated 1.283–1.45 V and backward compatible to 1.5 V ± 0.075 V; Innodisk lists its industrial modules for both 1.35 V and 1.5 V. [1] [2]

Why does an ECC DDR3 module have nine chips?

Innodisk's ECC UDIMM is x72; with 512M × 8 chips, a 64-bit rank needs eight chips and the 8 check bits one more. [3]

What temperature range do industrial DDR3 modules cover?

Innodisk and Transcend specify −40 to 85 °C operation; Micron's industrial DDR3L chips are rated −40 to 95 °C case temperature with a 32 ms refresh above 85 °C. [2] [6] [1]

Sources and what still needs a direct check

Sources checked 2026-10-13. Chip voltage, temperature and refresh figures come from Micron's 2Gb DDR3L datasheet; module grades, ECC, VLP and rugged options from Innodisk's DDR3 product pages; the industrial SO-DIMM specification from Transcend's product sheet.

  1. Micron — 2Gb x4, x8, x16 DDR3L SDRAM datasheet, MT41K512M4/MT41K256M8/MT41K128M16, Rev. N 07/16 (copy hosted by DESY) ↗ Component datasheet Return to text ↑
  2. Innodisk — DDR3 Wide Temp. SODIMM, product specifications ↗ Manufacturer product page Return to text ↑
  3. Innodisk — DDR3 Wide Temp. ECC UDIMM, product specifications ↗ Manufacturer product page Return to text ↑
  4. Innodisk — DDR3 ECC UDIMM VLP, product specifications ↗ Manufacturer product page Return to text ↑
  5. Innodisk — DDR3 XR-DIMM, product specifications ↗ Manufacturer product page Return to text ↑
  6. Transcend — DDR3 Industrial SO-DIMM, product sheet ↗ Manufacturer product sheet Return to text ↑

Still to check yourself

  • Check the board's memory support list.
  • Match DDR3 or DDR3L voltage.
  • Specify ambient and chip temperature grades.
  • Confirm ECC support on the chipset.
  • Verify the legal supplier and factory.
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