Silicon Dioxide Matrix: Particle Size D50 45-65 μm

Q: What is the maximum operating temperature for silicon dioxide matrix?

The silicon dioxide matrix maintains structural integrity up to 1200°C continuously, with short-term exposure capability up to 1400°C. The softening point exceeds 1650°C.

Q: How does particle size affect performance in industrial applications?

Controlled particle size distribution (45-65 μm D50) ensures optimal packing density, flow characteristics, and sintering behavior. Finer particles improve surface area for reactions, while coarser particles enhance flowability in powder handling systems.

Q: What industries commonly use high-purity fused silica powder matrix?

Primary applications include semiconductor manufacturing (wafer carriers, diffusion tubes), optical components (lenses, prisms), high-temperature furnace linings, investment casting molds, and laboratory equipment requiring chemical inertness.

Component Specifications

Definition

A synthetic amorphous silicon dioxide (SiO₂) matrix produced through high-temperature fusion of quartz sand, characterized by extremely low impurity levels (<10 ppm metallic impurities), high chemical purity (>99.99% SiO₂), and controlled particle size distribution. This material forms the foundational matrix for high-purity fused silica products used in semiconductor, optical, and high-temperature industrial applications where thermal shock resistance, low thermal expansion, and optical transparency are critical.

Working Principle

Functions as a thermally stable, chemically inert matrix that maintains structural integrity at temperatures up to 1200°C. The amorphous structure prevents crystalline phase transitions, while the high purity minimizes contamination in sensitive applications. The material's low coefficient of thermal expansion (0.55 × 10⁻⁶/K) provides exceptional thermal shock resistance.

Materials

Synthetic amorphous silicon dioxide (SiO₂), purity >99.99%, particle size distribution: D50 = 45-65 μm, specific surface area: 2-4 m²/g, bulk density: 0.8-1.2 g/cm³, moisture content: <0.1%

Technical Parameters

Parameter	Typical range	Notes & selection driver
Purity	>99.99% SiO₂
Bulk Density	0.8-1.2 g/cm³
Softening Point	>1650°C
Refractive Index	1.458 @ 589 nm
Particle Size D50	45-65 μm
Dielectric Constant	3.8 @ 1 MHz
Metallic Impurities	<10 ppm
Thermal Conductivity	1.4 W/(m·K)
Specific Surface Area	2-4 m²/g
Thermal Expansion Coefficient	0.55 × 10⁻⁶/K

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 16220, ISO 3262-20, DIN 55913, ASTM E222

Parent Products

This component is used in the following industrial products

High-Purity Fused Silica Powder

High-purity fused silica powder is an amorphous, non-crystalline form of silicon dioxide produced by melting high-quality quartz sand at extremely high temperatures followed by rapid cooling and pulverization.

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Engineering Analysis

Risks & Mitigation

Respirable crystalline silica exposure during handling
Thermal shock if heated/cooled too rapidly
Moisture absorption affecting flow properties
Electrostatic buildup during powder transfer

FMEA Triads

Trigger: Inadequate particle size control during manufacturing
Failure: Poor sintering density and mechanical weakness
Mitigation: Implement statistical process control with laser diffraction particle size analysis and adjust milling parameters accordingly

Trigger: Metallic contamination from processing equipment
Failure: Reduced purity affecting semiconductor yield
Mitigation: Use ceramic-lined equipment, implement regular purity testing, and establish material traceability protocols

Trigger: Moisture absorption during storage
Failure: Agglomeration and inconsistent flow properties
Mitigation: Store in sealed containers with desiccant, control relative humidity below 40%, and implement moisture testing before use

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Particle size distribution: ±5% of D50 value; Chemical purity: ±0.01% of specified value; Bulk density: ±0.1 g/cm³

Test Method

Particle size: ISO 13320 laser diffraction; Chemical purity: ISO 16220 XRF analysis; Thermal properties: ASTM E228 dilatometry; Moisture content: ISO 787-2 loss on drying

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

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Inspection readiness

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Manufacturers of Silicon Dioxide Matrix

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Frequently Asked Questions

What is the maximum operating temperature for silicon dioxide matrix?

The silicon dioxide matrix maintains structural integrity up to 1200°C continuously, with short-term exposure capability up to 1400°C. The softening point exceeds 1650°C.

How does particle size affect performance in industrial applications?