INDUSTRY COMPONENT

Silicon Dioxide Matrix

Ultra-pure fused silica powder matrix used in high-temperature industrial applications requiring exceptional thermal stability and chemical inertness.

Component Specifications

Definition
A synthetic amorphous silicon dioxide (SiO₂) matrix produced through high-temperature fusion of quartz sand, characterized by extremely low impurity levels (<10 ppm metallic impurities), high chemical purity (>99.99% SiO₂), and controlled particle size distribution. This material forms the foundational matrix for high-purity fused silica products used in semiconductor, optical, and high-temperature industrial applications where thermal shock resistance, low thermal expansion, and optical transparency are critical.
Working Principle
Functions as a thermally stable, chemically inert matrix that maintains structural integrity at temperatures up to 1200°C. The amorphous structure prevents crystalline phase transitions, while the high purity minimizes contamination in sensitive applications. The material's low coefficient of thermal expansion (0.55 × 10⁻⁶/K) provides exceptional thermal shock resistance.
Materials
Synthetic amorphous silicon dioxide (SiO₂), purity >99.99%, particle size distribution: D50 = 45-65 μm, specific surface area: 2-4 m²/g, bulk density: 0.8-1.2 g/cm³, moisture content: <0.1%
Technical Parameters
  • Purity >99.99% SiO₂
  • Bulk Density 0.8-1.2 g/cm³
  • Softening Point >1650°C
  • Refractive Index 1.458 @ 589 nm
  • Particle Size D50 45-65 μm
  • Dielectric Constant 3.8 @ 1 MHz
  • Metallic Impurities <10 ppm
  • Thermal Conductivity 1.4 W/(m·K)
  • Specific Surface Area 2-4 m²/g
  • Thermal Expansion Coefficient 0.55 × 10⁻⁶/K
Standards
ISO 16220, ISO 3262-20, DIN 55913, ASTM E222

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Silicon Dioxide Matrix.

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Respirable crystalline silica exposure during handling
  • Thermal shock if heated/cooled too rapidly
  • Moisture absorption affecting flow properties
  • Electrostatic buildup during powder transfer
FMEA Triads
Trigger: Inadequate particle size control during manufacturing
Failure: Poor sintering density and mechanical weakness
Mitigation: Implement statistical process control with laser diffraction particle size analysis and adjust milling parameters accordingly
Trigger: Metallic contamination from processing equipment
Failure: Reduced purity affecting semiconductor yield
Mitigation: Use ceramic-lined equipment, implement regular purity testing, and establish material traceability protocols
Trigger: Moisture absorption during storage
Failure: Agglomeration and inconsistent flow properties
Mitigation: Store in sealed containers with desiccant, control relative humidity below 40%, and implement moisture testing before use

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Particle size distribution: ±5% of D50 value; Chemical purity: ±0.01% of specified value; Bulk density: ±0.1 g/cm³
Test Method
Particle size: ISO 13320 laser diffraction; Chemical purity: ISO 16220 XRF analysis; Thermal properties: ASTM E228 dilatometry; Moisture content: ISO 787-2 loss on drying

Buyer Feedback

★★★★☆ 4.9 / 5.0 (29 reviews)

"Standard OEM quality for Non-Metallic Mineral Product Manufacturing applications. The Silicon Dioxide Matrix arrived with full certification."

"Great transparency on the Silicon Dioxide Matrix components. Essential for our Non-Metallic Mineral Product Manufacturing supply chain."

"The Silicon Dioxide Matrix we sourced perfectly fits our Non-Metallic Mineral Product Manufacturing production line requirements."

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Frequently Asked Questions

What is the maximum operating temperature for silicon dioxide matrix?

The silicon dioxide matrix maintains structural integrity up to 1200°C continuously, with short-term exposure capability up to 1400°C. The softening point exceeds 1650°C.

How does particle size affect performance in industrial applications?

Controlled particle size distribution (45-65 μm D50) ensures optimal packing density, flow characteristics, and sintering behavior. Finer particles improve surface area for reactions, while coarser particles enhance flowability in powder handling systems.

What industries commonly use high-purity fused silica powder matrix?

Primary applications include semiconductor manufacturing (wafer carriers, diffusion tubes), optical components (lenses, prisms), high-temperature furnace linings, investment casting molds, and laboratory equipment requiring chemical inertness.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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