Dongguan Jianchuang Electronic Technology Co., Ltd. presents its custom circuit manufacturing through the Chipsimple and ThickFilmPCB names. Its published work centres on ceramic thick film circuits, printed resistors, resistive sensor cards and thick film heaters, developed from customer drawings and operating requirements at its Dongguan production site.
What the published manufacturing scope means for a buyer.
The distinctive purchasing decision is the functional material stack: substrate, conductor, resistor or heater pattern, insulation, protection and assembly interface. Chipsimple's published process connects screen printing and thermal processing with laser trimming and inspection. A drawing review can therefore address the circuit's electrical or thermal function together with the way it will be mounted, connected and tested in the buyer's assembly. [1] [9]
The ceramic-circuit family combines conductors with optional resistors, dielectric crossovers, vias and protective layers. Bare printed substrates and downstream assembly requirements are identified as separate quotation scopes. This is relevant when interconnection and passive functions need to be considered on the same ceramic part. [3]
The company describes printing, drying, material-specific firing or curing, trimming, finishing and inspection as linked decisions. Its capability material asks for the layer artwork, material system, measurement conditions and assembly interfaces before releasing the process. The route is selected for the particular circuit rather than inferred from its product name. [2]
A published quality-system certificate names Dongguan Jianchuang and identifies a Dongguan production address. Its scope includes production and sales of thick-film and thin-film ceramic circuit boards and thick-film heating elements. Separate published sample reports address restricted substances and an alumina composition test; these serve different evidence purposes. [10]
CNFX synthesis of the company’s published information.
The reviewed families have different control variables and should not be reduced to a single generic ceramic-PCB specification.
Alumina and selected AlN routes are described with printed conductors, resistors, dielectric layers, crossovers and vias. Specify the substrate grade and outline, layer artwork, firing sequence, electrical targets and soldering or bonding interfaces. The existing CNFX Ceramic PCB association is relevant to this family. [3]
The capabilities page describes fixed resistance values, ratios, dividers and laser-adjusted resistance functions. These projects require the target values, tolerance, reference temperature, loading and measurement method together. A tight trimmed value does not by itself define temperature drift or long-term stability. [2]
The fuel-level card is presented as a custom contact pattern and resistance function for a defined sender mechanism. Its review covers float or linkage travel, curve points, wiper interface and terminals. Tank-volume conversion, mechanism hysteresis and final gauge behaviour belong to the assembled system, not the card alone. [4]
The stainless-steel heating-plate page combines a metal plate, dielectric stack and printed heating pattern. It discusses zones, terminals, grounding, mounting and heat removal as part of the assembly. Ceramic and other heater routes are also offered for review; power and temperature targets need the actual thermal boundary and test plan. [5]
The company also lists flexible polyimide and carbon-on-FR-4 routes. These use compatible curing systems and should be kept distinct from fired ceramic thick film. Specify bending or contact requirements, the copper interface, ink function and assembly conditions for these projects. [2]
Published processes, organized by production stage.
Release the outline, functional artwork, substrate, printed-material system and assembly interfaces together. For a sensor add curve and contact data; for a heater add voltage, thermal load, mounting and temperature limits. [6]
The described route covers artwork and screen control, deposition, drying, compatible firing or curing and optional laser adjustment. The company presents workshop photographs as process context. Ask which operations and any partner steps belong to the chosen project. [6]
The published release framework links dimensions, electrical or functional tests, revision and lot records. Agree the sample acceptance method, traceability, component changes and shipment documents before moving from a prototype to recurring supply. [7]
Company-system evidence, material-sample evidence and a finished part's acceptance records answer different questions.
Published certificate 29024Q11475-05R0S names Dongguan Jianchuang and ISO 9001:2015, with issue date 21 May 2024 and printed expiry 20 May 2027. The document specifies annual surveillance conditions. Its registered/office address and production address are separate fields; use the production site and current status when arranging a supplier review. [10]
SGS report SZXEC25003987601, dated 24 October 2025, reports Pass for the stated RoHS testing on the identified ceramic printer heating-element sample. The seven-page report includes the tested part, methods, results and sample photograph. It is not a blanket certificate for every heater, sensor or material combination. [11]
The quality framework separates incoming checks, layer/process checks, dimensional and electrical inspection, reliability work and final release. A sensor needs curve and contact evidence; a heater needs insulation and thermal evidence for its assembly. Agree the method, conditions and record—not merely a test name. [7]
The website's application material describes engineering routes, not a list of independently verified customer installations.
Fuel, oil, position and throttle-related resistive elements are discussed around the mechanism and readout chain. A buyer should provide the transfer curve, mating contact and media or wear conditions so component acceptance and system validation can be separated. [4]
The published application routes include appliance/fluid heating, industrial sensing, power electronics and precision modules. Selection turns on interfaces, heat flow, isolation and validation requirements; an application label alone does not establish product approval for that sector. [8]
CNFX procurement assessment.
Chipsimple may suit OEM engineers who need a custom printed electrical or heating function tied to a defined substrate and assembly. Its strongest published material is the connection between artwork, materials, print/thermal processing, trimming and acceptance. Buyers needing an entire finished sensor, appliance or populated module should identify that additional supply scope explicitly.
Website research · 2026-10-01
Prepared from Chipsimple / ThickFilmPCB’s English website. Capability descriptions and application information are company-published; CNFX’s project-fit assessment is editorial analysis. Company claimed indicates profile management, not quality certification. Source methodology.
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