This page explains how Ceramic PCB is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board substrate made from ceramic materials instead of traditional FR-4 or other organic laminates.
Technical details and manufacturing context for Ceramic PCB
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thermal ConductivityRequired | 24–170 W/m·K | Measure of the ceramic material's ability to conduct heatASTM E1461 |
| Dielectric ConstantRequired | 6–9 dimensionless | Relative permittivity of the ceramic material at specific frequenciesIPC-TM-650 2.5.5.3 |
| Coefficient of Thermal ExpansionRequired | 4.5–7.5 ppm/°C | Rate of dimensional change with temperature variationASTM E831 |
| Operating Temperature RangeRequired | -55–850 °C | Minimum and maximum temperatures the PCB can withstand during operation |
| Substrate ThicknessRequired | 0.25–1.0 mm | Thickness of the ceramic substrate materialIPC-6012 |
| Bending Strength | 300–500 MPa | Higher for AlNASTM C1161 |
| Surface Roughness | 0.3–0.8 µm Ra | Affects adhesion and high-frequency lossISO 4287 |
| Copper Thickness | 17–70 µm | Typical 1 oz to 2 ozIPC-6012 |
| Peel Strength | 0.8–1.2 N/mm | For 35 µm CuIPC-TM-650 2.4.8 |
| Volume Resistivity | 10^13–10^15 Ω·cm | At 25°CASTM D257 |
| Dielectric Strength | 15–30 kV/mm | Higher for AlNASTM D149 |
| Dimensional Tolerance | ±0.1 mm | For length and widthIPC-6012 |
| Moisture Absorption | 0–0.1 % | Non-hygroscopicIPC-TM-650 2.6.2 |
| Weight | 3.0–3.9 g/cm³ | Density; Al2O3 ~3.9, AlN ~3.3ASTM C20 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Ceramic PCB.
| pressure: | Atmospheric to 1000 psi (depending on ceramic grade and bonding) |
| other spec: | Thermal conductivity: 20-200 W/mK (alumina to aluminum nitride), Dielectric strength: 10-40 kV/mm, CTE: 4-8 ppm/°C |
| temperature: | -55°C to +850°C continuous, up to +1000°C peak |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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The typical ceramic materials are aluminum oxide (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO). Each offers different thermal and electrical properties; for example, AlN has higher thermal conductivity and bending strength compared to Al2O3.
The thermal conductivity ranges from 24 to 170 W/m·K, depending on the ceramic material. This is significantly higher than traditional FR-4, enabling efficient heat dissipation.
Common standards include ASTM E1461 for thermal conductivity, IPC-TM-650 for dielectric constant and peel strength, ASTM E831 for coefficient of thermal expansion, IPC-6012 for substrate thickness and copper thickness, and ASTM D257 for volume resistivity. Always confirm compliance with the manufacturer.
Yes, the operating temperature range is -55 to 850 °C, making them suitable for extreme environments. However, the actual limit depends on the specific ceramic material and metallization, so verify with the supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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