Chemical agent used to remove oxygen from molten copper alloys during high-purity busbar production.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Dosage Rate | 0.1-0.5% of melt weight | |
| Melting Point | 700-900°C | |
| Residual Oxygen | <10 ppm | |
| Phosphorus Content | 8-15% in CuP alloys | |
| Oxygen Removal Efficiency | >95% |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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Oxygen causes copper oxide formation that reduces electrical conductivity by up to 30% and creates weak points in the microstructure, leading to premature failure in high-current applications.
Phosphorus forms P2O5 gas that bubbles out, while lithium creates Li2O slag; phosphorus leaves residual phosphorus that improves fluidity but slightly reduces conductivity, whereas lithium leaves minimal residue.
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