Bonding layer for tungsten-rhenium target disks in X-ray tubes and medical imaging equipment.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Void Content | <2% | |
| Bond Strength | ≥80 MPa at 400°C | |
| Thickness Tolerance | ±10 μm | |
| Thermal Conductivity | ≥200 W/m·K | |
| Thermal Cycling Endurance | >50,000 cycles (20°C to 400°C) | |
| Operating Temperature Range | -50°C to 600°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A specialized rotating disk within medical X-ray tube anode assemblies that generates X-rays through electron bombardment.
A multi-layer assembly of piezoelectric ceramic elements that generates precise linear displacement when voltage is applied.
Components designed to reduce or eliminate the transmission of vibration from a vibrator/exciter to surrounding structures or equipment.
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Manufacturer profiles associated with Bonding Layer.
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The bonding layer prevents target disk delamination under extreme thermal cycling (up to 2500°C surface temperatures) and centrifugal forces (up to 10,000 RPM), ensuring continuous heat transfer to the copper heat sink and preventing catastrophic failure in medical X-ray equipment.
High-temperature brazing alloys like silver-copper eutectic (Ag72Cu28) or gold-copper (Au80Cu20) are standard, with nickel-based alloys containing titanium/vanadium additives for enhanced wetting properties and oxidation resistance at elevated temperatures.
Quality is verified through ultrasonic testing (void detection), shear strength testing at elevated temperatures, thermal cycling endurance tests, and microstructural analysis using scanning electron microscopy to ensure proper alloy diffusion and interface integrity.
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