Bonding wires are ultra-thin conductive wires used to create electrical connections between semiconductor chips and their packages in LED arrays.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Diameter | 15-50 μm | |
| Elongation | 4-8% | |
| Loop Height | 100-300 μm | |
| Resistivity | 2.2-2.5 μΩ·cm (gold) | |
| Tensile Strength | 8-12 g-force |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A structured arrangement of multiple LED chips mounted on a substrate to form a lighting module.
Electronic circuit component that amplifies and conditions signals from counting circuitry for reliable transmission to external devices.
The active component within a voltage regulator IC that controls the output voltage by adjusting its resistance.
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Gold is most common due to its excellent conductivity and corrosion resistance; aluminum and copper are alternatives for cost-sensitive applications.
Poor bonding can cause high resistance, overheating, or open circuits, leading to LED failure or reduced brightness.
Thermosonic ball bonding (common for gold) and ultrasonic wedge bonding (for aluminum or copper).
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