INDUSTRY COMPONENT

Connector Array

A multi-port connector array for high-density signal transmission in camera interface boards.

Component Specifications

Definition
A connector array is a precisely engineered assembly of multiple electrical connectors arranged in a specific pattern on a printed circuit board (PCB), designed to facilitate simultaneous, reliable connections for data, power, and control signals between a camera sensor module and the main processing unit of a camera interface board. It ensures high-speed signal integrity, mechanical stability, and electromagnetic compatibility in imaging systems.
Working Principle
The connector array operates by providing multiple conductive pathways (pins, pads, or sockets) that align with corresponding contacts on a mating component (e.g., a camera module flex cable). When engaged, these pathways establish electrical continuity, allowing for the transmission of digital image data, synchronization signals, power, and ground connections. The array's design minimizes crosstalk, impedance mismatches, and insertion loss through controlled impedance routing, shielding, and precise mechanical alignment.
Materials
Contacts: Phosphor bronze or beryllium copper with gold or tin plating (0.5-2.0 μm). Housing: High-temperature thermoplastics (e.g., LCP, PBT, PPS) with UL94 V-0 flammability rating. PCB substrate: FR-4 or high-frequency laminates (e.g., Rogers). Solder: Lead-free SAC305 alloy.
Technical Parameters
ParameterTypical rangeNotes & selection driver
Pitch0.4 mm to 1.27 mm
Durability≥ 5000 mating cycles
Current Rating0.5 A per contact
Voltage Rating50 V AC/DC
Insertion Force0.5 N to 2.0 N per contact
Contact Resistance≤ 20 mΩ
Number Of Positions20 to 120
Insulation Resistance≥ 1000 MΩ
Operating Temperature-40°C to +85°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards
IEC 60512, IPC-A-610

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Signal integrity loss due to poor contact
  • Mechanical failure from repeated mating cycles
  • Thermal stress on solder joints
  • Electromagnetic interference (EMI)
FMEA Triads
Trigger: Misalignment during assembly
Failure: Bent pins or poor contact leading to signal loss
Mitigation: Use alignment guides, precision jigs, and automated optical inspection (AOI)
Trigger: Thermal cycling
Failure: Solder joint cracking causing intermittent connections
Mitigation: Implement strain relief, use flexible solder alloys, and follow IPC reflow profiles
Trigger: Contamination (dust, moisture)
Failure: Increased contact resistance or short circuits
Mitigation: Apply conformal coating, use sealed connectors, and maintain cleanroom assembly

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance
Positional tolerance ±0.05 mm, coplanarity ≤0.1 mm
Test Method
Electrical continuity test, insulation resistance test (500 V DC), mechanical durability test per IEC 60512, signal integrity analysis via TDR

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Connector Array

Manufacturer profiles associated with Connector Array.

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Frequently Asked Questions

What is the main purpose of a connector array on a camera interface board?

It provides a compact, reliable interface for connecting a camera sensor module to the board, enabling simultaneous transmission of image data, power, and control signals while maintaining signal integrity.

How do I select the right connector array for my camera application?

Consider pitch size, number of positions, current/voltage ratings, operating temperature, mating durability, and compliance with industry standards like IEC 60512. Match it to your camera module's flex cable specifications.

What are common failure modes in connector arrays?

Contact wear, solder joint cracks, misalignment, contamination, and signal degradation due to impedance mismatches or crosstalk.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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