PCB substrate is the foundational insulating layer that provides mechanical support and electrical connectivity for electronic components in high-speed memory modules.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thickness | 0.2-3.2 mm | |
| Copper Weight | 0.5-2 oz | |
| Thermal Conductivity | 0.3-2.0 W/mK | |
| Dissipation Factor (Df) | <0.02 | |
| Dielectric Constant (Dk) | 3.5-4.5 | |
| Glass Transition Temperature (Tg) | >170°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
Printed circuit board with integrated memory chips for temporary data storage in computing devices.
Electronic components that provide temporary data storage for the main processor board
A modular assembly of multiple LED chips arranged in a specific pattern, designed as a replaceable component within a programmable lighting system.
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The PCB substrate provides mechanical support, electrical insulation, and controlled impedance for signal routing, ensuring reliable data transmission at high frequencies while managing thermal dissipation.
Material choice affects dielectric properties, thermal management, and signal loss. High-frequency laminates with low Dk and Df values are preferred for minimizing signal degradation in high-speed applications.
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