Non-volatile memory component for data storage in Bluetooth modules and electronic devices.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Package | SOIC, TSOP, BGA, WLCSP | |
| Voltage | 1.8V, 3.3V | |
| Capacity | 4MB to 16MB typical for Bluetooth modules | |
| Endurance | 10,000 to 100,000 write/erase cycles | |
| Interface | SPI, I2C, or parallel | |
| Data Retention | 10-20 years | |
| Operating Temperature | -40°C to +85°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A compact electronic component that enables wireless Bluetooth connectivity and audio transmission.
A printed circuit board (PCB) that enables wireless network connectivity for smart home devices.
A compact integrated circuit designed to govern specific operations within the Cell Monitoring Unit (CMU), executing programmed instructions to monitor and manage battery cell parameters.
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Flash memory provides persistent storage for firmware, device settings, and pairing data without power consumption, enabling Bluetooth modules to retain critical information through power cycles.
NAND flash offers higher density and lower cost per bit, making it suitable for storing larger firmware files in Bluetooth modules. NOR flash allows execute-in-place capability but is less common due to higher cost.
Access speed and interface (SPI vs parallel) impact firmware loading time and data transfer rates. Higher endurance ratings ensure reliability over the product lifecycle.
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