LED chips/dies

LED chips, also known as LED dies, are the core semiconductor components within LED packages that generate light through electroluminescence. These chips consist of multiple semiconductor layers (typically gallium nitride-based materials) deposited on a substrate. When forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The wavelength (color) of emitted light depends on the semiconductor material's bandgap energy. LED chips are characterized by their small size (typically 0.1-1.0 mm²), high luminous efficiency, and directional light emission.

LED chips operate on the principle of electroluminescence in semiconductor materials. When forward bias voltage is applied to the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. These charge carriers recombine radiatively, releasing energy as photons. The semiconductor material's bandgap determines the photon energy and thus the emitted light wavelength. The chip structure includes multiple epitaxial layers (n-type, active region, p-type) grown on a substrate, with metal contacts for electrical connection.