LED Array Module for Programmable Lighting Systems

Product Specifications

Technical details and manufacturing context for LED Array Module

Definition

The LED Array Module is a critical component of the Programmable Lighting System, consisting of multiple individual LED chips mounted on a substrate and arranged in a predetermined configuration (such as matrix, linear, or circular patterns). It serves as the primary light-emitting element that can be individually controlled or addressed by the system's controller to create dynamic lighting effects, color mixing, and intensity variations. Within the system, it interfaces with power supplies, drivers, and control circuits to execute programmed lighting sequences. The module is designed as a replaceable part, allowing for maintenance or upgrades without replacing the entire lighting system. Its construction includes a PCB substrate that provides electrical connections and mechanical support, with LED chips mounted and encapsulated using epoxy or silicone for protection. Thermal interface materials are used to manage heat dissipation, ensuring reliable operation within specified temperature ranges. The module's performance is characterized by parameters such as the number of LED chips (24–96), power consumption (30–120 W), forward voltage (24–48 V DC), luminous flux (3000–12000 lm), color temperature (2700–6500 K), color rendering index (80–95 Ra), operating temperature (-20 to 60 °C), storage temperature (-40 to 85 °C), IP rating (IP54–IP65 per IEC 60529), module dimensions (100×100 to 300×300 mm), weight (0.5–2.5 kg), and lifetime (50000–100000 hours per IES LM-80). These values are typical ranges and must be verified for the specific model and application. The module is intended for use in programmable lighting systems where dynamic control is required. It is not a standalone luminaire and requires appropriate drivers and controllers. For procurement, verify model-specific specifications and compliance with relevant standards with the legal manufacturer or supplier.

Working Principle

The module operates by converting electrical energy into light through semiconductor electroluminescence. When forward voltage is applied to the LED chips, electrons recombine with electron holes within the device, releasing energy in the form of photons. The array configuration allows for individual or grouped control of LEDs, enabling complex lighting patterns, color temperature adjustments, and dimming capabilities when integrated with the system's programmable controller. The controller sends signals to drivers that regulate current to each chip or group, thereby controlling intensity and color. Heat generated during operation is conducted through the substrate and thermal interface material to a heat sink or housing, maintaining junction temperature within safe limits. The module's design ensures that each chip can be addressed independently, providing flexibility in creating dynamic lighting effects.

Common Materials

LED chips (semiconductor material), PCB substrate, Encapsulation epoxy/silicone, Thermal interface material

Technical Parameters

Parameter	Typical range	Notes & selection driver
Number of LED Chips	24–96 pcs	Determines light output and resolution
Power Consumption	30–120 W	Total module power at rated current
Forward Voltage	24–48 V DC	Typical operating voltage range
Luminous Flux	3000–12000 lm	Total luminous output at rated current
Color Temperature	2700–6500 K	CCT range available
Color Rendering Index	80–95 Ra	Higher CRI for accurate color
Operating Temperature	-20–60 °C	Ambient temperature range
Storage Temperature	-40–85 °C	Non-operating storage range
IP Rating	IP54–IP65	Dust and water resistanceIEC 60529
Module Dimensions	100×100–300×300 mm	Length × width, varies by chip count
Weight	0.5–2.5 kg	Depends on heat sink and housing
Lifetime	50000–100000 h	L70 lumen maintenanceIES LM-80

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

LED chips Part
Primary light-emitting semiconductor elements

Material: Gallium arsenide/Gallium nitride semiconductor
PCB substrate Part
Provides electrical connections and mechanical support for LED chips

Material: FR-4 or aluminum PCB
Thermal pad Part
Dissipates heat from LED chips to prevent overheating

Material: Thermal conductive material
Connector Part
Electrical interface for power and control signals

Material: Plastic with metal contacts

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Programmable Lighting System

View system integration details

Manufacturers of LED Array Module

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Frequently Asked Questions

What is the typical power consumption of an LED array module?

The typical power consumption ranges from 30 to 120 watts at rated current, depending on the number of LED chips and their drive conditions. Always verify the exact value for the specific module model.

Can the LED array module be used outdoors?

The module has an IP rating of IP54 to IP65 per IEC 60529, indicating dust and water resistance. However, suitability for outdoor use depends on the complete housing and installation. Confirm with the manufacturer for the intended environment.

How is the color temperature controlled?

The module supports a color temperature range of 2700 to 6500 K. Control is achieved through the programmable controller, which adjusts the current to different LED chips or groups to mix colors and achieve the desired CCT.

What is the expected lifetime of the module?

The lifetime is rated at 50,000 to 100,000 hours for L70 lumen maintenance per IES LM-80. Actual lifespan depends on operating conditions, thermal management, and driver quality. Verify with the manufacturer for specific models.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric only (non-pressurized enclosure)
other spec:	Max forward current: 350mA per LED, IP65 ingress protection rating
temperature:	-40°C to +85°C operating, -55°C to +100°C storage

LED Array Module

Product Specifications

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

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